參數(shù)資料
型號： 573100D00010G
廠商： Aavid Thermalloy
文件頁數(shù)： 35/116頁
文件大?。?/td> 0K
描述： BOARD LEVEL HEAT SINK
產(chǎn)品培訓(xùn)模塊： How to Select a Heat Sink
標(biāo)準(zhǔn)包裝： 250
類型： 頂部安裝
冷卻式包裝： TO-252（DPak）
固定方法： SMD 基座
形狀： 矩形
長度： 0.315" (8mm)
寬： 0.90"（22.86mm）
機座外的高度（散熱片高度）： 0.400"（10.16mm）
溫升時的功耗： 0.75W @ 30°C
在強制氣流下的熱敏電阻： 在 600 LFM 時為12.5°C/W
自然環(huán)境下的熱電阻： 15°C/W
材料表面處理： 錫
其它名稱： 041639
25
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
7109
Surface mount heat sink for D
2 PAK (TO-263) package semiconductors
Surface mount heat sink for D
2 PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
25.40
(1.000)
19.38
(0.763)
15.24
(0.600)
11.43
(0.450)
11.43
(0.450)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
5
0
20
40
60
80
100
01
2
3
4
5
4
3
1
2
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
1.3
(0.05)
12.70
(0.500)
10.16
(0.400)
7.37
(0.290)
30.99
(1.220)
17.53
(0.690)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
20
0
10
20
30
40
50
0.0
0.5
1.0
1.5
2.0
2.5
16
12
4
8
0
400
200
600
800
1000
Ca
se
T
emp
R
ise
Ri
se
A
bo
ve
Ambien
t—°
C
Surface mount heat sink for D
3 PAK
(TO-268) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
5734
Surface mount heat sink for D
3 PAK (TO-268) package semiconductors
Tape and Reel information
Part Number
“A” Dim
“B” Dim
“C” Dim
“D” Dim
7106D/TRG
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
7109D/TRG
44.00 (1.730)
40.40 (1.590)
36.00 (1.420)
4.06 (0.160)
573100D00010G
44.00 (1.730)
40.40 (1.590)
16.00 (0.630)
4.06 (0.160)
573300D00010G
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
573400D00010G
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
ORDERING INFORMATION
SMT
ORDERING INFORMATION
Part Number
Packaging
7109D/TRG
13" Reel, 125 per reel
7109DG
Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Refer to Figure D on page 26 for board footprint information
ORDERING INFORMATION
Part Number
Packaging
573400D00010G
13" Reel, 250 per reel
573400D00000G
Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Refer to Figure A and B on page 26 for board footprint information
A
B
C
D
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
573100D00010G 制造商:Aavid Thermalloy 功能描述:Heat Sink
573-1119-0301-100 制造商:Dialight 功能描述:
573-117-10 制造商:Mitutoyo Corporation 功能描述:CALIPER, DIG , 10-300MM
573131-000 制造商:TE Connectivity 功能描述:Cable Accessories Transition Fluoropolymer 制造商:TE Connectivity 功能描述:BOOT MOLDED 制造商:TE Connectivity 功能描述:382C312-125-0
573-1313-0101-100 制造商:Dialight 功能描述:
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