參數(shù)資料
型號： 533522B02552G
廠商： Aavid Thermalloy
文件頁數(shù)： 76/116頁
文件大?。?/td> 0K
描述： BOARD LEVEL HEAT SINK
產(chǎn)品培訓模塊： How to Select a Heat Sink
標準包裝： 250
類型： 插件板級，垂直
冷卻式包裝： TO-220（雙）
固定方法： 夾和 PC 引腳
形狀： 矩形
長度： 2.000"（50.80mm）
寬： 1.650"（41.91mm）
機座外的高度（散熱片高度）： 1.000"（25.40mm）
溫升時的功耗： 6W @ 30°C
在強制氣流下的熱敏電阻： 在 800 LFM 時為1.0°C/W
自然環(huán)境下的熱電阻： 2.7°C/W
材質(zhì)： 鋁
材料表面處理： 黑色陽極化處理
其它名稱： 041758
62
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
5922
Plug in style heat sink
Plug in style heat sink requires no
hardware to attach to the device.
The four spring action clips apply
even pressure eliminating gaps
between the heat sink and device
which rob thermal performance.
24.89
(0.980)
50.04
(1.970)
49.53
(1.950)
11.94
(0.470)
12.70
(0.500)
5.08
(0.200)
1.27
(0.050)
1.90
(0.075)
1.02
(0.040)
0.81
(0.032)
26.54
(1.045)
25.40
(1.000)
Part Number
Description
592201B03400G
High power plug in heat sink with folded back fins
2.39 (0.094)
and solderable mounting tabs
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
2.0
0
20
40
60
80
100
04
8
12
16
20
1.6
1.2
0.4
0.8
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
ORDERING INFORMATION
41.66
(1.640)
24.77
(0.975)
3.81
(0.150)
THRU
20.57
(0.810)
43.18
(1.700)
8.89
(0.350)
12.70
(0.500)
5.08
(0.200)
1.27
(0.050)
2.54
(0.100)
CL
6.22
(0.245)
0.81
(0.032)
1.02
(0.040)
Part Number
Description
593101B03600G
Channel style heat sink with folded back fins
2.92 (0.115)
and solderable tabs
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Channel style heat sink with
folded back fins for extra cooling
capacity. The heat sink features sol-
derable tabs for easy attachment
to the PC board.
5931
Channel style heat sink with folded back fins
7130
Copper slide on heat sink
requires no hardware to
attach the device. In addition,
the copper heat sink is tin/lead
plated to allow easy soldering
to the PC board.
26.04
(1.025)
9.52
(0.375)
25.53
(1.005)
15.49
(0.610)
16.51
(0.650)
1.27
(0.050)
3.81
(0.150)
2.79
(0.110)
1.27
(0.050)
17.15
(0.675)
Top cut away
to show detail
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
01
2
3
4
5
8
6
2
4
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Part Number
Description
7130DG
Slide on, channel style heat sink with integrated tabs
2.54 (0.100)
ORDERING INFORMATION
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
TO-218 Heat Sinks
Position
Code
Description
Details
A
1
Kon-DuxTM pad
Page 86
A
3
In-Sil-8TM pad
Page 86
POPULAR OPTIONS:
Base part no.
A
593101B 0 0000G
For additional options see page 82
ORDERING INFORMATION
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Mounting
Kits
page 99
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
相關(guān)PDF資料
PDF描述
542502D00000G BOARD LEVEL HEAT SINK
5519 210 MM X 155 MM X 2.0 MM THERM PAD 5519 210X155MM 2.0MM
5591S 210 MM X 300 MM 2.5 MM THERM PAD 5591S 210X300MM 2.5MM
5592 210 MM X 300 MM 2.0 MM THERM PAD 5592 210X300MM 2.0MM
5595 210 MM X 300 MM 2.0 MM THERM PAD 5595 210X300MM 2.0MM
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