參數資料
型號： 533522B02552G
廠商： Aavid Thermalloy
文件頁數： 29/116頁
文件大?。?/td> 0K
描述： BOARD LEVEL HEAT SINK
產品培訓模塊： How to Select a Heat Sink
標準包裝： 250
類型： 插件板級，垂直
冷卻式包裝： TO-220（雙）
固定方法： 夾和 PC 引腳
形狀： 矩形
長度： 2.000"（50.80mm）
寬： 1.650"（41.91mm）
機座外的高度（散熱片高度）： 1.000"（25.40mm）
溫升時的功耗： 6W @ 30°C
在強制氣流下的熱敏電阻： 在 800 LFM 時為1.0°C/W
自然環(huán)境下的熱電阻： 2.7°C/W
材質： 鋁
材料表面處理： 黑色陽極化處理
其它名稱： 041758
2
GENER
AL
INFORMA
TION
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
How to Use This Catalog
Style description
for heat sink
Base part
number
Ordering information will
specify the base heat sink with
available accessories.
Aavid has a large selection of popular
options to enhance your heat sink selection.
This section will indicate the most popular
options available.
Detailed indexes are available
to select additional options.
Icons indicate that
a mounting kit, grease
or epoxy can be used
with the heat sink
Detailed description
illustrates the heat sink’s
differentiating features.
Semiconductor devices
have been included in photos to
assist in determining mounting
position.
Thermal graphs show natural and forced
convection based on black anodize finish.
For information on how to use a thermal graph,
please refer to page 11.
7022
Channel style heat sink with folded back fins
Channel style heat sink with
folded back fins for increased
cooling surface area. Available
with tin plated solderable tabs
for easy attachment to the
printed circuit card.
9.52
(0.375)
50.44
(1.986)
23.01
(0.906)
49.99
(1.968)
3.81
(0.150)
21.03
(0.828)
2x 3.81
(0.150)
2.02
(0.080)
2.67
(0.105)
24.16
(0.951)
4.83
(0.190)
3.18
(0.125)
2.29
(0.090)
2x
4.44
(0.175)
2x 2.03
(0.080)
"X"
14.48
(0.570)
TAB
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
5
0
20
40
60
80
100
04
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Part Number
Description
Finish
7022BG
Channel heat sink with folded back fins
Black anodize
7022PBG
Channel heat sink with folded back fins
Pre-black anodize*
7022B-MTG
With solderable tabs
Black anodize
2.90 (0.114)
7022PB-MTG
With solderable tabs
Pre-black anodize*
2.90 (0.114)
ORDERING INFORMATION
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
* Edges cut during the manufacturing process will be unfinished.
See page XX for more information
Position
Code
Description
Location
Details
A
TC11-MT
Insulated device mounting clip for T0-220 and solderable tabs
Hole X
Page
POPULAR OPTIONS:
Dia of PCB
Plated Thru
Hole for Tabs
7022B-
G
For additional options see page xx
TO-220 Heat Sinks
Semiconductor
device
Mechanical drawing
dimensions as shown
are mm (inches)
Material and finish
information is shown
for each part
Base part no.
A
Grease
Epoxy
&
page112
Mounting
Kits
page 99
RoHS Compliant
相關PDF資料
PDF描述
542502D00000G BOARD LEVEL HEAT SINK
5519 210 MM X 155 MM X 2.0 MM THERM PAD 5519 210X155MM 2.0MM
5591S 210 MM X 300 MM 2.5 MM THERM PAD 5591S 210X300MM 2.5MM
5592 210 MM X 300 MM 2.0 MM THERM PAD 5592 210X300MM 2.0MM
5595 210 MM X 300 MM 2.0 MM THERM PAD 5595 210X300MM 2.0MM
相關代理商/技術參數
參數描述
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533525006 制造商:JAEGER 功能描述:RECEPTACLE MINIATURE MALE 37WAY
533531071 制造商:Molex 功能描述:
53353-1071 功能描述:板對板與夾層連接器 0.8 BtB Wafer Assy S T SMT 10CktEmbsTpPkg RoHS:否 制造商:JAE Electronics 系列:WP3 產品類型:Receptacles 節(jié)距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點數量:50 排數:2 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A
53353-1091 制造商:MOLEX 功能描述:0.8MM BTB STR HDER 20CKT 533531091 10CKT TIN 1.8MM
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