參數(shù)資料
型號： 4953G
廠商： Aavid Thermalloy
文件頁數(shù)： 20/116頁
文件大小： 0K
描述： THERMAL EPOXY
MSDS 材料安全數(shù)據(jù)表： 4953A THERMALBOND MSDS
4953B THERMALBONDMSDS
標(biāo)準(zhǔn)包裝： 1
系列： Thermalbond™
類型： 環(huán)氧樹脂硬化劑
尺寸/尺寸： 4 磅包裝
其它名稱： 033871
116
THE
T
O
T
AL
INTEGR
A
T
ED
SOL
UTION
F
OR
C
OOLING
ELECTRONICS
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Aavid Thermalloy has the expertise to design and
manufacture cooling solutions spanning the entire
range of thermal efficiency and mechanical complexity.
The board level products displayed in this catalog
represent only a fraction of our capabilities. Most
applications require custom solutions, which is why
so many leading electronics companies partner with
Aavid Thermalloy.
For demanding applications Aavid Thermalloy
can design and validate custom innovative solutions
utilizing the most advanced engineering resources
saving you precious development time. Our manufac-
turing facilities, located in strategic markets around
the globe, deliver cost effective products providing
you a competitive advantage. From concept to
production, Aavid Thermalloy can enable your
design anywhere in the world.
The Total Integrated Solution for Cooling Electronics
There are 4 cooling mechanisms that Aavid Thermalloy and Applied Thermal Technologies take pride in
having expertise in: natural convection, forced convection, fluid phase change and liquid cooling. The
above graph is a starting point to determine which technology can be used for your system configuration.
For more information regarding any of these cooling mechanisms, please contact Aavid Thermalloy at:
www.aavidthermalloy.com
Experts at solving cooling challenges ranging from
networking, telecom and consumer electronics, to
power and biomedical devices. Our clients include
Cisco, Nortel, HP, Apple, Sun, Bio-Rad, Mitsubishi and
other industry leading companies worldwide. Utilizing
the latest CFD/FEA and experimental techniques we can:
Perform conjugate analyses with conduction,
convection and radiation
Optimize venting and fan placement
Increase power density
Reduce noise, cost and size.
Increase MTBF
Dedicated thermal engineers characterize your system
and provide the most advanced and effective cooling
solutions, saving thousands in engineering resources,
thermal modeling software, and test hardware.
相關(guān)PDF資料
PDF描述
5-1542000-6 HEAT SINK BGA 25MM 2FIN RADIAL
5-1542003-0 25MM HS ASSY ULTEM CL
5-1542003-1 25MM HS ASSY ULTEM CL
5-1542003-9 27MM LOW P HS ASSY A-
5-1542004-4 HEAT SINK BGA 21MM 3FIN RADIAL
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
4954 功能描述:測試點 LOOP TEST POINT .020 RoHS:否 制造商:Keystone Electronics 安裝孔: 電路板厚度: 顏色:
4-954293-1 制造商:TE Connectivity 功能描述:
49544-0892 制造商:MOLEX 功能描述:
49545-0892 功能描述:集管和線殼 NEW MINIFIT Pin HSG in HSG Upper TPA-8P RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點類型:Pin (Male) 節(jié)距:1 mm 位置/觸點數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點材料:Brass 觸點電鍍:Gold 制造商:Hirose Connector
49-54-5615 制造商:MILWAUKEE TOOL 功能描述:DUST COLLECTION PORT
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