參數(shù)資料
型號： 4953G
廠商： Aavid Thermalloy
文件頁數(shù)： 113/116頁
文件大?。?/td> 0K
描述： THERMAL EPOXY
MSDS 材料安全數(shù)據(jù)表： 4953A THERMALBOND MSDS
4953B THERMALBONDMSDS
標準包裝： 1
系列： Thermalbond™
類型： 環(huán)氧樹脂硬化劑
尺寸/尺寸： 4 磅包裝
其它名稱： 033871
96
L
ABOR
SA
VING
HEA
T
SINK
T
O
BO
ARD
&
D
EVICE
T
O
H
EA
T
S
INK
MOUNT
S
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Solderable Studs
Studs
Threaded solderable studs are permanently swaged in place
for quick pre-assembly with the transistor. The device is
placed over the stud (s) followed by the lock washer and
nut. This entire component is then dropped into plated-thru
holes in the printed circuit board for wave soldering. The
end of the stud is tin-plated for excellent solderability and
extends only 0.040" below a 0.062" PC board to clear lead
trimming saws.
Device mounting studs for "Thermalloy-origin"
items are available as options on certain vertical
and board mount heat sinks as a labor-saving aid
for mounting semiconductors. This optional feature
speeds production assembly time and reduces
hardware requirements.
Device Mounting Studs
Suffix
Ordering code
Dia of PCB thru hole
“A” Dim
“B” Dim
“C” Dim
Figure
SE-1
08
3.68 (0.145)
8.89 (0.350)
6-32
1.13-1.26 (0.045-0.050)
A
SE-2
06
3.68 (0.145)
12.32 (0.485)
6-32
1.14-1.27 (0.045-0.050)
A
SE-3
09
3.68 (0.145)
8.89 (0.350)
4-40
1.14-1.26 (0.045-0.050)
A
SE-4
14
3.68 (0.145)
8.89 (0.350)
6-32
3.05 (0.120)
B
SM-1
17
3.68 (0.145)
8.89 (0.350)
M3 x 0.5
3.05 (0.120)
B
SM-3
07
3.68 (0.145)
8.89 (0.350)
M3 x 0.5
1.13-1.26 (0.045-0.050)
A
Suffix
Ordering code
“A” Dim
“B” Dim
“C” Dim
“D” Dim
SF1
11
7.92 (0.312)
4-40 UNC-2A
0.25 (0.010)
4.75 (0.187)
SF2
N/A
8.00 (0.315)
M3 x 0.5
0.25 (0.010)
4.60 (0.181)
SF3
N/A
7.92 (0.312)
6-32 UNC-2A
0.25 (0.010)
5.23 (0.206)
"B"
"D"
"A"
"C"
CL
Device
Mounting
Stud
Mechanical drawing showing heat sink with device mounting studs
PC BOARD
"C"
HEAT
SINK
PC BOARD
HEAT
SINK
5.49
(0.216)
"A"
"B"
"C"
501303B000 _ _ G
Ordering code
7022B–
G
B
529801B000 _ _G
Ordering code
7019B–
G
B
ORDERING INFORMATION
example 12 digit part
example
Thermalloy origin part
ORDERING INFORMATION
example 12 digit part
example
Thermalloy origin part
A
A = Model number
B = Stud suffix
C = RoHS compliant
A
A = Model number
B = Stud suffix
C = RoHS compliant
FIGURE B
FIGURE A
Typical installation
Note: Factory installed only
C
相關(guān)PDF資料
PDF描述
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5-1542003-1 25MM HS ASSY ULTEM CL
5-1542003-9 27MM LOW P HS ASSY A-
5-1542004-4 HEAT SINK BGA 21MM 3FIN RADIAL
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
4954 功能描述:測試點 LOOP TEST POINT .020 RoHS:否 制造商:Keystone Electronics 安裝孔: 電路板厚度: 顏色:
4-954293-1 制造商:TE Connectivity 功能描述:
49544-0892 制造商:MOLEX 功能描述:
49545-0892 功能描述:集管和線殼 NEW MINIFIT Pin HSG in HSG Upper TPA-8P RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點類型:Pin (Male) 節(jié)距:1 mm 位置/觸點數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點材料:Brass 觸點電鍍:Gold 制造商:Hirose Connector
49-54-5615 制造商:MILWAUKEE TOOL 功能描述:DUST COLLECTION PORT
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