參數(shù)資料
型號(hào): 4949G
廠商: Aavid Thermalloy
文件頁數(shù): 82/116頁
文件大?。?/td> 0K
描述: THERMAL EPOXY
MSDS 材料安全數(shù)據(jù)表: 4949A THERMALBOND MSDS
4949B THERMALBOND MSDS
標(biāo)準(zhǔn)包裝: 1
系列: Thermalbond™
類型: 環(huán)氧樹脂硬化劑
尺寸/尺寸: 25 克包裝
其它名稱: 038403
68
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
15.29
(0.602)
"A"
5.59
(0.220)
Part Number
“A” Dim
575200B00000G
18.29 (0.720)
575300B00000G
24.64 (0.970)
575400B00000G
30.99 (1.220)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—
°C/W
at
t
25
0
20
40
60
80
100
0.0
0.2
0.4
0.6
0.8
1.0
20
15
5
10
0
400
200
600
800
1000
575200
575400
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—
°C
Low cost slip on heat sink
features an expandable collar
that tightly grips the device
meaning no extra mounting
hardware is required. Three
heights to choose from.
5752, 5753, 5754 Low cost slip on heat sink
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
TO-92 Heat Sinks
ORDERING INFORMATION
13.70
(0.539)
13.80
(0.543)
10.16
(0.400)
1.00
(0.039)
11.40
(0.449)
2.50
(0.098)
0.40
(0.016)
8.50
(0.335)
4.27
(0.039)
Part Number
Description
92FG
Brass clip on heat sink
1.73 (0.068)
Air Velocity – Feet Per Minute
Heat Dissipated – Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient
°
C/Watt
25
0
20
40
60
80
100
01
2
3
4
5
20
15
5
10
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient
°
C
Low cost brass clip on heat sink
requires no hardware to attach
to the device. Includes integrated
tabs that can be soldered or twisted
to attach the heat sink to the board
reducing stress on the device leads.
92F
Low cost brass clip on heat sink
Material: 0.38 (0.015) Thick Brass
Finish: Unfinished
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
25
0
20
40
60
80
100
0.0
0.2
0.4
0.6
0.8
1.0
20
15
5
10
0
400
200
600
800
1000
575300
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Dia of PCB
Plated Thru
Hole for Tabs
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