參數(shù)資料
型號: 4949G
廠商: Aavid Thermalloy
文件頁數(shù): 36/116頁
文件大?。?/td> 0K
描述: THERMAL EPOXY
MSDS 材料安全數(shù)據(jù)表: 4949A THERMALBOND MSDS
4949B THERMALBOND MSDS
標準包裝: 1
系列: Thermalbond™
類型: 環(huán)氧樹脂硬化劑
尺寸/尺寸: 25 克包裝
其它名稱: 038403
26
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
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Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
FIGURE A
SMT Footprints
10.67
(0.420)
15.49
(0.610)
10.41
(0.410)
2.29
(0.090)
7.62
(0.300)
15.49
(0.610)
1.40
(0.060)
0.80
(0.030)
W
L
1
2
FIGURE B
FIGURE D
FIGURE C
L
W
16.76
(0.660)
2.54
(0.100)
10.67
(0.420)
20.32
(0.800)
2.54
(0.100)
Recommended copper heat speader drain pad footprint
Recommended heat sink solder mask opening
Note: The thickness of
the drain pad is variable
depending on the amount
of heat generated by the
SMT device, design limita-
tions and process.
Part Number
“L”
“W”
573100
9.53 (0.375)
13.97 (0.550)
573300
14.22 (0.560)
16.26 (0.640)
573400
14.22 (0.560)
21.08 (0.830)
Part Number
“L”
“W1”
“W2”
573100
9.02 (0.355)
13.46 (0.530)
8.89 (0.350)
573300
13.72 (0.540)
15.75 (0.620)
11.18 (0.440)
573400
13.72 (0.540)
20.57 (0.810)
16.00 (0.630)
Recommended copper pad size
for heat sink and device mounting footprint
For D Pak (TO-263)
For MO-184 and SO-10
Recommended copper pad size
for heat sink and device mounting footprint
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