
1
TO-220F
Item
Drain-source   voltage
Symbol
V
DS
V
DSX  *5
I
D
I
D(puls]
V
GS
I
AR               *2
E
AS             *1
dV
DS
/dt  
*4
dV/dt      
*3
P
D
    Ta=25°C
        Tc=25°C
T
ch
T
stg
V
ISO          *6
Ratings
Unit
 V
 V
 A
 A
 V
 A
 mJ
kV/μs
kV/μs
W
900
900
±6
±24
±30
Continuous  drain  current
Pulsed  drain  current
Gate-source  voltage
Repetitive or non-repetitive
Maximum Avalanche Energy
Maximum Drain-Source dV/dt
Peak Diode Recovery dV/dt
Max. power  dissipation
6
244
40
5
2.16
70
+150
-55 to +150
Operating  and  storage
temperature  range
Isolation Voltage
*1 L=12.4mH, Vcc=90V, Tch=25°C See to Avalanche Energy Graph    *2 Tch=
2
Electrical characteristics (T
c
 =25°C  unless otherwise specified)
Thermalcharacteristics
2SK3532-01MR
FUJI POWER MOSFET
Super FAP-G Series
N-CHANNEL SILICON POWER MOSFET
Features
High speed switching
Low on-resistance
No secondary breadown
Low driving power
Avalanche-proof
Applications
Switching regulators
UPS (Uninterruptible Power Supply)
DC-DC converters
Maximum ratings and characteristic
Absolute maximum ratings
(Tc=25°C  unless otherwise specified)
Item
             Symbol               Test Conditions
R
th(ch-c)                        
channel  to  case
R
th(ch-a)                        
channel   to  ambient
Zero  gate  voltage  drain  current                I
DSS
DS
=900V  V
GS
=0V
DS
=720V  V
GS
=0V
GS
=±30V
 I
D
=3A    V
GS
=10V
I
D
=3A    V
DS
=25V
V
DS
=25V
V
GS
=0V
f=1MHz
V
CC
=600V  I
D
=3A
V
GS
=10V
R
GS
=10 
Min.      Typ.        Max.    Units
900
3.0
V
V
μA
nA
S
pF
nC
A
V
μs
μC
ns
Min.      Typ.       Max.     Units
Thermal   resistance
  1.560
  58.0
°C/W
°C/W
Symbol
V
(BR)DSS
V
GS(th)
I
GSS
R
DS(on)
g
fs
C
iss
C
oss
C
rss
td
(on)
t
r
td
(off)
t
f
Q
G
Q
GS
Q
GD
I
AV
V
SD
t
rr
Q
rr
Item
Drain-source  breakdown  voltaget
Gate  threshold  voltage
Gate-source  leakage  current
Drain-source  on-state  resistance
Forward  transcondutance
Input  capacitance
Output  capacitance
Reverse  transfer  capacitance
Turn-on  time  t
on
Turn-off  time t
off
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Avalanche  capability
Diode  forward  on-voltage
Reverse  recovery  time
Reverse  recovery  charge
Test  Conditions
I
D
= 250μA      V
GS
=0V
I
D
= 250μA      V
DS
=V
GS
 V
ch
=25°C
 V
ch
=125°C
 V
DS
=0V
V
CC
=450V
I
D
=6A
V
GS
=10V
L=12.4mH  T
ch
=25°C
I
F
=6A   V
GS
=0V   T
ch
=25°C
I
F
=6A   V
GS
=0V
-di/dt=100A/μs    T
ch
=25°C
°C
°C
kVrms
5.0
25
250
100
2.50
1.92
7.4
3.7
750
100
1125
150
7
11
32
12
63
16.5
32
4.5
10.5
21
8
42
11
21.5
3
7
6
0.90
1.1
5.5
1.50
Outline Drawings  [mm]
Equivalent circuit schematic
*3  I
F
=
D
, -di/dt=50A/μs, Vcc=
DSS
, Tch=
Gate(G)
Source(S)
Drain(D)
200304
*4 VDS<
GS
=-30V  *6 t=60sec, f=60Hz