
1
Item
Drain-source   voltage
Symbol
V
DS
V
DSX  *5
I
D
I
D(puls]
V
GS
I
AR               *2
E
AS             *1
dV
DS
/dt  
*4
dV/dt      
*3
P
D
    Ta=25°C
        Tc=25°C
T
ch
T
stg
*3  I
F
   -I
D
, -di/dt=50A/μs, Vcc=
DSS
, Tch=
=
Ratings
Unit
 V
 V
 A
 A
 V
 A
 mJ
kV/μs
kV/μs
W
600
600
±17
±68
±30
17
412
20
Continuous  drain  current
Pulsed  drain  current
Gate-source  voltage
Repetitive or non-repetitive
Maximum Avalanche Energy
Maximum Drain-Source dV/dt
Peak Diode Recovery dV/dt
Max. power  dissipation
5
2.50
220
+150
-55 to +150
Operating  and  storage
temperature  range
Electrical characteristics (T
c
 =25°C  unless otherwise specified)
Thermalcharacteristics
2SK3527-01
FUJI POWER MOSFET
Super FAP-G Series
N-CHANNEL SILICON POWER MOSFET
Features
High speed switching
Low on-resistance
No secondary breadown
Low driving power
Avalanche-proof
Applications
Switching regulators
UPS (Uninterruptible Power Supply)
DC-DC converters
Maximum ratings and characteristic
Absolute maximum ratings
(Tc=25°C  unless otherwise specified)
Item
             Symbol               Test Conditions
R
th(ch-c)                        
channel  to  case
R
th(ch-a)                        
channel   to  ambient
Zero  gate  voltage  drain  current                I
DSS
DS
=600V  V
GS
=0V
DS
=480V  V
GS
=0V
 V
GS
 I
D
=8.5A    V
GS
=10V
I
D
=8.5A    V
DS
=25V
V
DS
=25V
V
GS
=0V
f=1MHz
V
CC
=300V  I
D
=8.5A
V
GS
=10V
R
GS
=10 
Min.      Typ.        Max.    Units
600
3.0
V
V
μA
nA
S
pF
nC
A
V
μs
μC
ns
Min.      Typ.       Max.     Units
Thermal   resistance
  0.568
  50.0
°C/W
°C/W
Symbol
V
(BR)DSS
V
GS(th)
I
GSS
R
DS(on)
g
fs
C
iss
C
oss
C
rss
td
(on)
t
r
td
(off)
t
f
Q
G
Q
GS
Q
GD
I
AV
V
SD
t
rr
Q
rr
Item
Drain-source  breakdown  voltaget
Gate  threshold  voltage
Gate-source  leakage  current
Drain-source  on-state  resistance
Forward  transcondutance
Input  capacitance
Output  capacitance
Reverse  transfer  capacitance
Turn-on  time  t
on
Turn-off  time t
off
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Avalanche  capability
Diode  forward  on-voltage
Reverse  recovery  time
Reverse  recovery  charge
Test  Conditions
I
D
= 250μA      V
GS
=0V
I
D
= 250μA      V
DS
=V
GS
V
ch
=25°C
V
ch
=125°C
      =±30V
DS
=0V
V
CC
=300V
I
D
=17A
V
GS
=10V
L=2.62mH  T
ch
=25°C
I
F
=17A   V
GS
=0V   T
ch
=25°C
I
F
=17A   V
GS
=0V
-di/dt=100A/μs    T
ch
=25°C
°C
°C
5.0
25
250
100
0.37
10
0.29
20
2280
290
16
26
37
78
13
54
15
20
10
3420
435
24
39
56
117
19
81
23
30
17
0.93
0.7
10.0
1.50
Outline Drawings
Equivalent circuit schematic
Gate(G)
Source(S)
Drain(D)
*1 L=2.62mH, Vcc=60V    *2 Tch=
*4 VDS<
GS
=-30V