
1
Item
Drain-source   voltage
Continuous  drain  current
Pulsed  drain  current
Gate-source  voltage
Repetitive or non-repetitive
Maximum Avalanche Energy
Maximum Drain-Source dV/dt
Peak Diode Recovery dV/dt
Max. power  dissipation
Symbol
V
DS
I
D
I
D(puls]
V
GS
I
AR               *2
E
AS             *1
dV
DS
/dt  
*4
dV/dt      
*3
P
D
    Ta=25°C
        Tc=25°C
T
ch
T
stg
Ratings
Unit
 V
 A
 A
 V
 A
 mJ
kV/μs
kV/μs
W
600
±8
±32
±30
8
145.6
20
5
1.67
135
+150
-55 to +150
Operating  and  storage
temperature  range
*1 L=4.2mH, Vcc=60V, See to Avalanche Energy Graph    *2 Tch=
Electrical characteristics (T
c
 =25°C  unless otherwise specified)
Thermalcharacteristics
2SK3526-01L,S,SJ
FUJI POWER MOSFET
Super FAP-G Series
N-CHANNEL SILICON POWER MOSFET
Features
High speed switching
Low on-resistance
No secondary breadown
Low driving power
Avalanche-proof
Applications
Switching regulators
UPS (Uninterruptible Power Supply)
DC-DC converters
Maximum ratings and characteristic
Absolute maximum ratings
(Tc=25°C  unless otherwise specified)
Item
             Symbol               Test Conditions
R
th(ch-c)                        
channel  to  case
R
th(ch-a)                        
channel   to  ambient
Zero  gate  voltage  drain  current                I
DSS
DS
=600V  V
GS
=0V
DS
=480V  V
GS
=0V
 V
GS
=±30V
 I
D
=3A    V
GS
=10V
I
D
=3A    V
DS
=25V
V
DS
=25V
V
GS
=0V
f=1MHz
V
CC
=300V  I
D
=3A
V
GS
=10V
R
GS
=10 
Min.      Typ.        Max.    Units
600
3.0
V
V
μA
nA
S
pF
nC
A
V
μs
μC
ns
Min.      Typ.       Max.     Units
Thermal   resistance
  0.926
  75.0
°C/W
°C/W
Symbol
V
(BR)DSS
V
GS(th)
I
GSS
R
DS(on)
g
fs
C
iss
C
oss
C
rss
td
(on)
t
r
td
(off)
t
f
Q
G
Q
GS
Q
GD
I
AV
V
SD
t
rr
Q
rr
Item
Drain-source  breakdown  voltaget
Gate  threshold  voltage
Gate-source  leakage  current
Drain-source  on-state  resistance
Forward  transcondutance
Input  capacitance
Output  capacitance
Reverse  transfer  capacitance
Turn-on  time  t
on
Turn-off  time t
off
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Avalanche  capability
Diode  forward  on-voltage
Reverse  recovery  time
Reverse  recovery  charge
Test  Conditions
I
D
= 250μA      V
GS
=0V
I
D
= 250μA      V
DS
=V
GS
V
ch
=25°C
V
ch
=125°C
                   V
DS
=0V
V
CC
=300V
I
D
=6A
V
GS
=10V
L=4.2mH  T
ch
=25°C
I
F
=6A   V
GS
=0V   T
ch
=25°C
I
F
=6A   V
GS
=0V
-di/dt=100A/μs    T
ch
=25°C
°C
°C
5.0
25
250
100
1.20
10
0.93
6
3
750
100
1130
150
4.0
14
9
24
7
20
8.5
5.5
6.0
21
14
36
10.5
30
13
8.5
8
1.00
0.7
3.5
1.50
Outline Drawings  [mm]
Gate(G)
Source(S)
Drain(D)
*3  I
F
=
D
, -di/dt=50A/μs, Vcc=
DSS
, Tch=
*4 VDS<
P4
200304