參數(shù)資料
型號(hào)： 120608
廠商： California Micro Devices Corporation
英文描述： ESD Protection Arrays, Chip Scale Package
中文描述： ESD保護(hù)陣列，芯片級(jí)封裝
文件頁數(shù)： 7/7頁
文件大?。?/td> 239K
代理商： 120608
2004 California Micro Devices Corp. All rights reserved.
06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
7
CM1206
Mechanical Details (cont’d)
CM1206-16 20-bump CSP Mechanical Specifications
The CM1206-16 devices are packaged in a 20-bump
custom Chip Scale Package (CSP). Dimensions are
presented below.
Package Dimensions for
CM1206-16 20-bump Chip Scale Package
CSP Tape and Reel Specifications
Figure 6. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
20
Dim
Millimeters
Nom
Inches
Nom
Min
Max
Min
Max
A1
A2
B1
B2
C1
C2
D1
D2
2.409
2.454
2.499
0.0948
0.0966
0.0984
3.059
3.104
3.149
0.1204
0.1222
0.1240
0.645
0.650
0.655
0.0254
0.0256
0.0258
0.645
0.650
0.655
0.0254
0.0256
0.0258
0.202
0.252
0.302
0.0080
0.0099
0.0119
0.202
0.252
0.302
0.0080
0.0099
0.0119
0.638
0.707
0.776
0.0251
0.0278
0.0306
0.394
0.445
0.495
0.0155
0.0175
0.0195
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
4
5
B
C1
B1
A1
B
C
D1
D2
A
BOTTOM VIEW
SIDE
VIEW
A
1
2
3
DIMENSIONS IN MILLIMETERS
A
B
C
D
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
OptiGuard
TM
Coating
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B
0
X A
0
X K
0
3.28 X 2.64 X 0.86
TAPE WIDTH
W
REEL
DIAMETER
QTY
PER
REEL
P
0
4mm
P
1
4mm
CM1206-16
3.104 X 2.454 X 0.707
8mm
178mm (7")
3500
Top
For tape feeder reference
only including draft.
P
1
K
o
Embossment
User Direction of Feed
±
P
o
Center Lines
of Cavity
W
T0.2 mm
A
o
B
o
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