參數(shù)資料
型號(hào)： 120608
廠商： California Micro Devices Corporation
英文描述： ESD Protection Arrays, Chip Scale Package
中文描述： ESD保護(hù)陣列，芯片級(jí)封裝
文件頁(yè)數(shù)： 4/7頁(yè)
文件大?。?/td> 239K
代理商： 120608
2004 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
06/28/04
CM1206
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration
Figure 2. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 3. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.300mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.350mm Round
Solder Stencil Thickness
0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.360mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
+50
μ
m
+20
μ
m
60 seconds
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Soldering Maximum Temperature
260°C
Solder Mask Opening
0.350mm DIA.
Non-Solder Mask Defined Pad
0.300mm DIA.
Solder Stencil Opening
0.360mm DIA.
200
250
150
100
50
0
1:00.0
2:00.0
Time (minutes)
3:00.0
4:00.0
T
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