參數(shù)資料
型號(hào)： 0W344-005-XTP
廠商： ON SEMICONDUCTOR
元件分類： 數(shù)字信號(hào)處理
英文描述： BelaSigna 200 - Single-Chip Audio Processing System; Package: 52 PIN QFN 8x8; No of Pins: 52; Container: Tape and Reel; Qty per Container: 1000
中文描述： 0-BIT, 33 MHz, MIXED DSP, QCC52
封裝： 8 X 8 MM, QFN-52
文件頁(yè)數(shù)： 5/43頁(yè)
文件大小： 1426K
代理商： 0W344-005-XTP
BelaSigna 200
4.2.3. CSP Environmental Characteristics
All parts supplied against this specification have been qualified as follows:
Table 5:
Packaging Level
Moisture sensitivity level (MSL)
JEDEC Level 3
30°C / 60% RH for 192 hours
Pressure cooker test (PCT)
121°C / 100% RH / 2 atm for 168 hours
Thermal cycling test (TCT)
-65°C to 150°C for 1000 cycles
Highly accelerated stress test (HAST)
130°C / 85% RH for 100 hours
High temperature stress test (HTST)
150°C for 1000 hours
Board Level
Temperature
-40°C to 125°C for 1000 cycles with no failures
(for board thickness <40mils and underfilled CSP)
Drop
1m height with no failures
4.2.4. CSP Carrier Information
The devices will be provided in standard 7” Tape & Reel carrier with 5,000 parts per reel.
Note: all dimensions in millimeters
Figure 8: CSP Tape Dimensions
4.2.5. CSP Design Considerations
In order to achieve the highest level of miniaturization, the CSP package is constrained in ways that will factor into design decisions.
The CSP will only operate in HV mode, and therefore requires a 1.8V operating voltage. The number of pins is reduced to 40
(compared to 49 active pins on the QFN). This reduction eliminates access to GPIOs (0,1,2,6,15), LSAD 2, the I2S interface, and the IR
remote receiver.
For PCB manufacture with BelaSigna 200 CSP, ON Semiconductor recommends Solder-on-Pad (SoP) surface finish. With SoP, the
solder mask opening should be solder mask-defined and copper pad geometry will be dictated by the PCB vendor’s design
requirements.
Rev. 16 | Page 13 of 43 | www.onsemi.com
相關(guān)PDF資料
PDF描述
0W588-002-XUA BelaSigna 200 - Single-Chip Audio Processing System; Package: WLCSP 40, 3.8x2.3; No of Pins: 40; Container: Tape and Reel; Qty per Container: 5000
0W633-001-XTP BelaSigna 250 - 16 bit Audio Processor, Full Stereo 2-in, 2-out; Package: LFBGA 57, 5x5; No of Pins: 57; Container: Tape and Reel; Qty per Container: 5000
0W888-002-XTP BelaSigna 250 - 16 bit Audio Processor, Full Stereo 2-in, 2-out; Package: LFBGA 64, 7x7; No of Pins: 64; Container: Tape and Reel; Qty per Container: 1500
0X860 OSCILLOSCOPE 100MHz ANALOGUE
2-5174339-5 68 CONTACT(S), MALE, STRAIGHT TELECOM AND DATACOM CONNECTOR, SOLDER
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
0W588-002-XUA 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC BELASIGNA 200 WLCSP RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
0W589-005-XDS 功能描述:音頻模/數(shù)轉(zhuǎn)換器 IC AUDIO AD/DA RoHS:否 制造商:Wolfson Microelectronics 轉(zhuǎn)換速率: 分辨率: ADC 輸入端數(shù)量: 工作電源電壓: 最大工作溫度: 最小工作溫度: 安裝風(fēng)格: 封裝 / 箱體: 封裝:
0W589-007-XDS 功能描述:音頻模/數(shù)轉(zhuǎn)換器 IC AUDIO AD/DA RoHS:否 制造商:Wolfson Microelectronics 轉(zhuǎn)換速率: 分辨率: ADC 輸入端數(shù)量: 工作電源電壓: 最大工作溫度: 最小工作溫度: 安裝風(fēng)格: 封裝 / 箱體: 封裝:
0W598001EVK 制造商:ON Semiconductor 功能描述:B250 EDK SGL PURCH - Bulk
0W633-001-XTP 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC BELASIGNA 250 CABGA 5X5 RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
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