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參數(shù)資料
| 型號(hào)： | μPD784031 |
| 廠商： | NEC Corp. |
| 英文描述： | 8/16 Bit Single Chip Microcontrollers(8/16 位微控制器) |
| 中文描述： | 8 / 16位單片機(jī)微控制器（8 / 16位微控制器） |
| 文件頁(yè)數(shù)： | 81/90頁(yè) |
| 文件大小： | 301K |
| 代理商： | ΜPD784031 |
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μ
PD784031
81
Table 16-1. Soldering Conditions for Surface-Mount Devices (2/2)
(3)
μ
PD784031GK-BE9: 80-pin plastic TQFP (fine pitch) (12
×
12 mm)
Note
Maximum number of days during which the product can be stored at a temperature of 25
°
C and a relative
humidity of 65 % or less after dry-pack package is opened.
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
Soldering process
Infrared ray reflow
VPS
Partial heating method
Symbol
IR35-107-2
VP15-107-2
-
Soldering conditions
Peak package’s surface temperature: 235
°
C
Reflow time: 30 seconds or less (210
°
C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 7 days
Note
(10 hours of pre-baking is required at 125
°
C
afterward)
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
baked before unpacking.
Peak package’s surface temperature: 215
°
C
Reflow time: 40 seconds or less (200
°
C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 7 days
Note
(10 hours of pre-baking is required at 125
°
C
afterward)
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
baked before unpacking.
Terminal temperature: 300
°
C or less
Heat time: 3 seconds or less (for one side of a device)
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