參數(shù)資料
型號(hào): μPD75P70076
廠商: NEC Corp.
英文描述: 4 Bit Single Chip Microcontrollers(4位單片微控制器)
中文描述: 4位單片微控制器(4位單片微控制器)
文件頁數(shù): 53/62頁
文件大?。?/td> 290K
代理商: ΜPD75P70076
m
PD75P0076
53
12. RECOMMENDED SOLDERING CONDITIONS
The
m
PD75P0076 should be soldered and mounted under the conditions recommended in the table below.
For details of recommended soldering conditions, refer to the information document
“Semiconductor Device
Mounting Technology Manual” (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC Sales representative.
Table 12-1. Surface Mounting Type Soldering Conditions
m
PD75P0076GT: 42-pin plastic shrink SOP (375 mil, 0.8 mm pitch)
Soldering
Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds or less (at 210°C or higher),
Number of reflow processes: Twice or less
IR35-00-2
VPS
Package peak temperature: 215°C, Time: 40 seconds or less (at 200°C or higher),
Number of reflow processes: Twice or less
VP15-00-2
Wave soldering
Solder temperature: 260°C or below, Time: 10 seconds or less, Number of flow
process: 1, Preheating temperature: 120°C or below (Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300°C or below, Time : 3 seconds or less (per device side)
Caution
Use of more than one soldering method should be avoided (except for partial heating).
Table 12-2. Insertion Type Soldering Conditions
m
PD75P0076CU: 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)
Soldering Method
Soldering Conditions
Wave soldering (pins only)
Solder bath temperature: 260 °C or less, Time: 10 seconds or less
Partial heating
Pin temperature: 300 °C or below, Time: 3 seconds or less (per device side)
Caution
Ensure that the application of wave soldering is limited to the pins and no solder touches the
main unit directly.
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