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參數(shù)資料
| 型號： | μPD75P3216 |
| 廠商： | NEC Corp. |
| 英文描述： | 4 Bit Single Chip Microcontrollers(4位單片微控制器) |
| 中文描述： | 4位單片微控制器（4位單片微控制器） |
| 文件頁數(shù)： | 45/56頁 |
| 文件大?。?/td> | 347K |
| 代理商： | ΜPD75P3216 |
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45
m
PD75P3216
12. RECOMMENDED SOLDERING CONDITIONS
The
m
PD75P3216 should be soldered and mounted under the conditions recommended in the table below.
For details of recommended soldering conditions, refer to the information document
“Semiconductor Device
Mounting Technology Manual” (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC Sales representative.
Table 12-1. Surface Mounting Type Soldering Conditions
m
PD75P3216GT: 48-pin plastic shrink SOP (375 mil, 0.65-mm pitch)
Soldering
Method
Soldering Conditions
Symbol
Infrared rays
reflow
Peak package's surface temperature: 235 °C, Reflow time: 30 seconds or less
(at 210 °C or higher), Number of reflow processes: Twice max.
Number of days: 7
Note
(after that, prebaking is necessary at 125 °C for 10 hours)
<Precaution>
Products other than those supplied in thermal-resistant tray (magazine, taping, and non-
thermal-resistant tray) cannot be baked in their packs.
IR35-107-2
VPS
Peak package's surface temperature: 215 °C, Reflow time: 40 seconds or less
(at 200 °C or higher), Number of reflow processes: Twice max.
Number of days: 7
Note
(after that, prebaking is necessary at 125 °C for 10 hours)
<Precaution>
Products other than those supplied in thermal-resistant tray (magazine, taping, and non-
thermal-resistant tray) cannot be baked in their packs.
VP15-107-2
Wave soldering
Solder temperature: 260 °C or below, Flow time: 10 seconds or less, Number of
flow process: 1, Preheating temperature: 120 °C or below (Package surface temperature)
Number of days: 7
Note
(after that, prebaking is necessary at 125 °C for 10 hours)
WS60-107-1
Partial heating
Pin temperature: 300 °C or below, Time: 3 seconds or less (per device side)
—
Note
The number of days during which the product can be stored at 25 °C, 65 % RH max. after the dry
pack has been opened.
Caution
Use of more than one soldering method should be avoided (except for partial heating).
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| PD75R-103K | 功能描述:固定電感器 10uH 10% .08ohm Choke SMT Power Ind RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
| PD75R-104K | 功能描述:固定電感器 100uH 10% .5ohm Choke SMT Power Ind RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
| PD75R-104K/R500 | 制造商:API Delevan 功能描述:PD75R series 100 uH 10 % 740 mA SMT Power Choke |
| PD75R-123K | 功能描述:固定電感器 12uH 10% .085ohm Choke SMT Power Ind RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
| PD75R-123K TR 500 | 制造商:API Delevan 功能描述:POWER CHOKE 12 UH 10% SMD |
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