3
m
PD75P3216
CONTENTS
1.
PIN CONFIGURATION (Top View) ................................................................................................... 4
2.
BLOCK DIAGRAM ............................................................................................................................. 5
3.
PIN FUNCTIONS ................................................................................................................................ 6
3.1
Port Pins ...................................................................................................................................................... 6
3.2
Non-port Pins.............................................................................................................................................. 7
3.3
Equivalent Circuits for Pins...................................................................................................................... 8
3.4
Recommended Connection of Unused Pins ........................................................................................ 10
4.
Mk I AND Mk II MODE SELECTION FUNCTION ........................................................................... 11
4.1
Difference between Mk I Mode and Mk II Mode ................................................................................... 11
4.2
Setting of Stack Bank Selection (SBS) Register ................................................................................. 12
5.
Differences between
m
PD75P3216 and
m
PD753204, 753206, and 753208 ............................... 13
6.
MEMORY CONFIGURATION .......................................................................................................... 14
7.
INSTRUCTION SET.......................................................................................................................... 16
8.
ONE-TIME PROM (PROGRAM MEMORY) WRITE AND VERIFY ................................................ 25
8.1
Operation Modes for Program Memory Write/Verify........................................................................... 25
8.2
Program Memory Write Procedure ........................................................................................................ 26
8.3
Program Memory Read Procedure ........................................................................................................ 27
8.4
One-time PROM Screening ..................................................................................................................... 28
9.
ELECTRICAL SPECIFICATIONS .................................................................................................... 29
10. CHARACTERISTIC CURVE (REFERENCE VALUE)..................................................................... 42
11. PACKAGE DRAWINGS ................................................................................................................... 44
12. RECOMMENDED SOLDERING CONDITIONS .............................................................................. 45
APPENDIX A.
m
PD753108, 753208, AND 75P3216 FUNCTIONAL LIST .......................................... 46
APPENDIX B. DEVELOPMENT TOOLS .............................................................................................. 48
APPENDIX C. RELATED DOCUMENTS.............................................................................................. 52