參數(shù)資料
型號: μPD75P0116
廠商: NEC Corp.
英文描述: 4 Bit RISC Microcontrollers(4 位單片微控制器)
中文描述: 4位RISC微控制器(4位單片微控制器)
文件頁數(shù): 51/62頁
文件大?。?/td> 309K
代理商: ΜPD75P0116
m
PD75P0116
51
13. RECOMMENDED SOLDERING CONDITIONS
Solder the
m
PD75P0116 under the following recommended conditions.
For the details on the recommended soldering conditions, refer to Information Document
Semiconductor
Device Mounting Technology Manual (C10535E)
.
For the soldering methods and conditions other than those recommended, consult NEC.
Table 13-1. Soldering Conditions of Surface Mount Type
m
PD75P0116GB-3BS-MTX: 44-pin plastic QFP (10
10 mm, 0.8-mm pitch)
Symbol of
recommended
condition
Soldering method
Soldering conditions
Infrared reflow
Package peak temperature: 235 °C, Time: 30 seconds max. (210 °C min.),
Number of times: 3 max.
IR35-00-3
VPS
Package peak temperature: 215 °C, Time: 40 seconds max. (200 °C min.),
Number of times: 3 max.
VP15-00-3
Wave soldering
Soldering bath temperature: 260 °C max., Time: 10 seconds max.,
Number of times: 1
WS60-00-1
Preheating temperature: 120 °C max. (package surface temperature)
Partial heating
Pin temperature: 300 °C max., Time: 3 seconds max. (per side of device)
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
Table 13-2. Soldering Conditions of Insertion Type
m
PD75P0116CU: 42-pin plastic Shrink DIP (600 mil, 1.778-mm pitch)
Soldering method
Soldering conditions
Wave soldering (pin only)
Partial heating
Soldering bath temperature: 260 °C max., Time: 10 seconds max.
Pin temperature: 300 °C max., Time: 3 seconds max. (per pin)
Caution Apply wave soldering to the pins only. Be careful not to allow solder jet to come into direct contact
with the body of the chip.
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