參數(shù)資料
型號： μPD70P3002
廠商： NEC Corp.
英文描述： 16/32 Single -Chip Microcontroller(16/32 位單片微控制器)
中文描述： 16/32單片機（16/32位單片微控制器）
文件頁數(shù)： 6/56頁
文件大?。?/td> 367K
代理商： ΜPD70P3002
μ
PD70P3002
6
CONTENTS
1. DIFFERENCES BETWEEN
μ
PD70P3002 AND
μ
PD703002 ................................................................7
2. PIN FUNCTION LIST..............................................................................................................................8
2.1 Normal Operation Mode (MODE0 = L, MODE1 = H) ..................................................................................... 8
2.1.1 Port pins ................................................................................................................................................ 8
2.1.2 Non-port pins ........................................................................................................................................ 9
2.2 PROM Programming Mode (MODE0 = H, MODE1 = H) .............................................................................. 11
2.3 Pin I/O Circuits and Recommended Connections of Unused Pins .......................................................... 12
3. PROM PROGRAMMING ......................................................................................................................14
3.1 Operation Mode............................................................................................................................................. 14
3.2 PROM Writing Procedure ............................................................................................................................. 16
3.3 PROM Reading Procedure ........................................................................................................................... 20
4. SCREENING OF ONE-TIME PROM VERSION ...................................................................................21
5. NOTES ON RELEASING STOP MODE WHEN EXTERNAL CLOCK IS USED .................................21
6. ELECTRICAL SPECIFICATIONS ........................................................................................................22
7. CHARACTERISTICS CURVES (REFERENCE) ..................................................................................47
8. PACKAGE DRAWING ..........................................................................................................................48
9. RECOMMENDED SOLDERING CONDITIONS ...................................................................................49
APPENDIX PROM WRITING TOOLS ......................................................................................................50
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