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參數(shù)資料
| 型號(hào)： | μPC8129GR |
| 廠商： | NEC Corp. |
| 英文描述： | Silicon MMIC Frequency DownConverter(下變頻轉(zhuǎn)換器芯片) |
| 中文描述： | 硅單片頻率下變頻（下變頻轉(zhuǎn)換器芯片） |
| 文件頁數(shù)： | 27/28頁 |
| 文件大?。?/td> | 587K |
| 代理商： | ΜPC8129GR |
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Data Sheet P12781EJ2V0DS00
27
μ
PC8129GR
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electrostatic sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.x. 1000 pF) to the V
CC
pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering method and
conditions than the recommended conditions are to be consulted with sales representatives.
μ
PC8129GR
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak package’s surface temperature: 235 °C or below,
Reflow time: 30 seconds or below (210 °C or higher)
Number of reflow process: 2, Exposure limit
Note
: None
IR35-00-2
VPS
Peak package’s surface temperature: 215 °C or below,
Reflow time: 40 seconds or below (200 °C or higher)
Number of reflow process: 2, Exposure limit
Note
: None
VP15-00-2
Wave soldering
Solder temperature: 260 °C or below,
Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limit
Note
: None
WS60-00-1
Partial heating method
Terminal temperature: 300 °C or below,
Flow time: 3 seconds/pin or below,
Exposure limit
Note
: None
Note
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 °C and relative humidity at 65 % or less.
Caution Apply only a single process at once, except for “Partial heating method”.
For details of recommended soldering conditions for surface mounting, refer to information
document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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