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參數(shù)資料
| 型號： | μPC3210TB |
| 廠商： | NEC Corp. |
| 英文描述： | 5 V, Super Minimold Silicon MMIC Amplifier(單片微波放大器芯片) |
| 中文描述： | 5伏，硅超Minimold MMIC放大器（單片微波放大器芯片） |
| 文件頁數(shù)： | 14/16頁 |
| 文件大小： | 87K |
| 代理商： | ΜPC3210TB |
Data Sheet P13593EJ2V0DS00
14
μ
PC3210TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to V
CC
line.
(4) The DC cut capacitor must be each attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
μ
PC3210TB
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit
Note
: None
IR35-00-3
VPS
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit
Note
: None
VP15-00-3
Wave Soldering
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit
Note
: None
WS60-00-1
Partial Heating
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit
Note
: None
–
Note
After opening the dry pack, keep it in a place below 25
°
C and 65 % RH for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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