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參數(shù)資料
| 型號(hào)： | μPC1658G |
| 廠商： | NEC Corp. |
| 英文描述： | Low Noise, High Frequncy Si MMIC Amplifier(低噪聲高頻率放大器) |
| 中文描述： | 低噪聲，高硅Frequncy MMIC放大器（低噪聲高頻率放大器） |
| 文件頁數(shù)： | 8/12頁 |
| 文件大小： | 73K |
| 代理商： | ΜPC1658G |
Data Sheet P11120EJ3V0DS00
8
μ
PC1658G
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) Because the components will operate at high frequencies, apply chip capacitors and chip resistors with low
parasitic inductance.
(4) The DC capacitor must be attached to input pin and output pin.
(5) The bypass capacitor should be attached to V
CC
line.
(6) In case of improved output level type application circuit, observe precaution not to exceed the power
dissipation rating, especially in V
CC
= 9 V or over.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit: None
Note
IR35-00-3
VPS
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit: None
Note
VP15-00-3
Wave Soldering
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Note
WS60-00-1
Partial Heating
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Note
–
Note
After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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