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參數(shù)資料
| 型號： | μPB1510GV |
| 廠商： | NEC Corp. |
| 英文描述： | 3 GHz Input Divided By 4 Prescale(3 GHz 定標(biāo)器) |
| 中文描述： | 3 GHz的輸入除以4預(yù)分頻（3 GHz的定標(biāo)器） |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 139K |
| 代理商： | ΜPB1510GV |
11
PB1510GV
μ
NOTE CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1 000 pF) to the V
CC
pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit
Note
: None
IR35-00-3
VPS
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit
Note
: None
VP15-00-3
Wave Soldering
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit
Note
: None
WS60-00-1
Partial Heating
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit
Note
: None
–
Note
After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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