參數(shù)資料
型號(hào): ZSM530G
廠商: ZETEX PLC
元件分類(lèi): 電源管理
英文描述: Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT01; No. of Contacts:10; Connector Shell Size:12; Connecting Termination:Solder; Circular Shell Style:Cable Receptacle; Body Style:Straight
中文描述: 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO4
封裝: SOT-223, 4 PIN
文件頁(yè)數(shù): 2/5頁(yè)
文件大?。?/td> 140K
代理商: ZSM530G
TEST CONDITIONS
(T
amb
=25°C for typical values, T
amb
=-40 to 85°C for min/max values (Note3))
COMPARATOR
PARAMETER
SYMBOL
MIN
TYP
MAX.
UNITS
Threshold Voltage
High state output (V
cc
increasing)
V
IH
4.2
4.31
4.4
V
Threshold Voltage
Low state output (V
cc
decreasing)
V
IL
4.2
4.29
4.4
V
Hysteresis
OUPUT
V
H
0.01
0.02
0.05
V
Output sink saturation:
V
OL
(V
cc
=3.8V, I
sink
=8.0mA)
0.46
1.0
V
(V
cc
=3.8V, I
sink
=2.0mA)
0.15
0.4
V
(V
cc
=1.0V, I
sink
=0.1mA)
0.25
V
Onstate output sink current
(V
cc
, Output=3.8V)
I
sink
10
27
60
mA
Offstate output leakage current
(V
cc
, Output=5V)
I
oh
0.02
0.5
μ
A
Clamp diode forward voltage
(I
f
=10mA)
V
f
0.6
1.2
1.5
V
Propagation delay
(V
in
5V to 3.8V, R
l
=10k, T
amb
=25°C)
TOTAL DEVICE
T
d
2
μ
s
Operating input voltage range
V
cc
1.0 to 6.5
V
Quiescent input current (V
cc
=5V)
Note:
1. Maximum package power dissipation must be observed.
2. Maximum power dissipation, for the SOT223 and SO8 packages, is calculated assuming
that the device is mounted on a PCB measuring 2 inches square.
3. Low duty cycle pulse techniques are used during test to maintain junction temperatures as
close to ambient as possible.
I
q
175
260
μ
A
ZSM530
ABSOLUTE MAXIMUM RATING
Input Supply Voltage
Offstate Output Voltage
Onstate Output
Sink Current(
Note 1
)
Clamp Diode
Forward Current(
Note 1
)
Operating Junction
Temperature
Operating Temperature
Storage Temperature
-1 to 10V
10V
Internally limited
100mA
150°C
-40 to 85°C
-55 to 150°C
Power Dissipation
TO92
SOT223
SO8
780mW
2W(
Note 2
)
780mW(
Note 2
)
4-355
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