參數(shù)資料
型號(hào): XX1001-BD-000W
廠商: MIMIX BROADBAND INC
元件分類: 衰減器
英文描述: 18.0-21.0/36.0-42.0 GHz GaAs MMIC Doubler and Power Amplifier
中文描述: 36000 MHz - 42000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
封裝: DIE-14
文件頁數(shù): 3/6頁
文件大小: 226K
代理商: XX1001-BD-000W
18.0-21.0/36.0-42.0 GHz GaAs MMIC
Doubler and Power Amplifier
Page 3 of 6
Mechanical Drawing
Bias Arrangement
Bypass Capacitors
- See App Note [2]
(Note: Engineering designator is 20DBL0629)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.987 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg2)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vd3)
Bond Pad #5 (Vd4)
Bond Pad #6 (Vd5)
Bond Pad #7 (Vd6)
Bond Pad #8 (RF Out)
Bond Pad #9 (Vg6)
Bond Pad #10 (Vg5)
Bond Pad #11 Vg4)
Bond Pad #12 (Vg3)
Bond Pad #13 (Vd1)
Bond Pad #14 (Vg1)
X1001-BD
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
January 2007 - Rev 26-Jan-07
1.700
(0.067)
1
2
3
4
5
6
7
8
9
10
11
12
13
0.295
(0.012)
0.694
(0.027)
1.095
(0.043)
1.494
(0.059)
2.503
(0.099)
2.096
(0.083)
1.495
(0.059)
1.095
(0.043)
0.695
(0.027)
0.295
(0.012)
0.0
0.0
0.605
(0.024)
14
2.096
(0.083)
2.705
(0.107)
0.638
(0.025)
3.000
(0.118)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
RF In
Vg1
RF Out
Vd1
Vg3,4,5
Vg6
Vg2
Vd2
Vd3,4,5
Vd6
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