參數(shù)資料
型號: XU1009-BD-000V
廠商: MIMIX BROADBAND INC
元件分類: 通信及網(wǎng)絡(luò)
英文描述: 18.0-36.0 GHz GaAs MMIC Transmitter
中文描述: SPECIALTY TELECOM CIRCUIT, UUC12
封裝: ROHS COMPLIANT, DIE-12
文件頁數(shù): 5/9頁
文件大?。?/td> 291K
代理商: XU1009-BD-000V
Vd2
Vg1
Vd3
IF2
LO
Vg4
IF1
Vd1
RF
Vg2
Vg3
1
2
3
4
8
9
10
5
6
7
11
12
Vss
1
2
3
4
8
9
10
0.295
(0.012)
2.000
(0.079)
0.305
(0.012)
0.904
(0.036)
1.904
(0.075)
5
2.104
(0.083)
6
2.504
(0.099)
7
2.904
(0.114)
3.200
(0.126)
0.996
(0.039)
2.704
(0.106)
2.305
(0.091)
11
0.904
(0.036)
0.0
0.0
12
0.504
(0.020)
18.0-36.0 GHz GaAs MMIC
Transmitter
Page 5 of 9
Mechanical Drawing
Bias Arrangement
Bypass Capacitors
- See App Note [2]
(Note: Engineering designator is 26TX0555)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC/IF Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.968 mg.
Bond Pad #1 (RF Out)
Bond Pad #2 (Vd1)
Bond Pad #3 (IF1)
Bond Pad #4 (Vg4)
Bond Pad #5 (Vg3)
Bond Pad #6 (Vg2)
Bond Pad #7 (Vss)
Bond Pad #8 (LO)
Bond Pad #9 (Vd3)
Bond Pad #10 (Vd2)
Bond Pad #11 (IF2)
Bond Pad #12 (Vg1)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
March 2007 - Rev 01-Mar-07
U1009-BD
XU1009-BD
XU1009-BD
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