REV. 1.0.0 8-BIT I2C/SMBUS GPIO EXPANDER WITH RESET PIN DESCRIPTIONS Pin Description NAME
參數資料
型號: XRA1202IG16-F
廠商: Exar Corporation
文件頁數: 10/16頁
文件大?。?/td> 0K
描述: IC I/O EXPANDER I2C 8B 16TSSOP
標準包裝: 95
接口: I²C,SM 總線
輸入/輸出數: 8
中斷輸出:
頻率 - 時鐘: 400kHz
電源電壓: 1.65 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-TSSOP(0.173",4.40mm 寬)
供應商設備封裝: 16-TSSOP
包裝: 管件
其它名稱: 1016-1713-5
XRA1202
3
REV. 1.0.0
8-BIT I2C/SMBUS GPIO EXPANDER WITH RESET
PIN DESCRIPTIONS
Pin Description
NAME
PIN#
TYPE
DESCRIPTION
I2C INTERFACE
SDA
13
15
I/O
I2C-bus data input/output (open-drain).
SCL
12
14
I
I2C-bus serial input clock.
IRQ#
11
13
OD
Interrupt output (open-drain, active LOW).
A0
A1
15
16
1
2
I
These pins select the I2C slave address. See
RESET#
1
3
I
Reset (active LOW) - A longer than 40 ns LOW pulse on this pin will reset the
internal registers and all GPIOs will be configured as inputs.
GPIOs
P0
P1
P2
P3
P4
P5
P6
P7
2
3
4
5
7
8
9
10
4
5
6
7
9
10
11
12
I/O
General purpose I/Os P0-P7. All GPIOs are configured as inputs upon power-
up or after a reset.
ANCILLARY SIGNALS
VCC
14
16
Pwr
1.65V to 3.6V VCC supply voltage.
GND
6
8
Pwr
Power supply common, ground.
GND
Center
Pad
-
Pwr
The exposed pad at the bottom surface of the package is designed for thermal
performance. Use of a center pad on the PCB is strongly recommended for ther-
mal conductivity as well as to provide mechanical stability of the package on the
PCB. The center pad is recommended to be solder masked defined with open-
ing size less than or equal to the exposed thermal pad on the package bottom to
prevent solder bridging to the outer leads of the device. Thermal vias must be
connected to GND plane as the thermal pad of package is at GND potential.
Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain.
QFN-16 TSSOP-16
相關PDF資料
PDF描述
616-220-306 UNI GUIDE
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