REV. 1.1.0 Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain. RESET# 18 12 21 14 " />
參數(shù)資料
型號: XR20M1170IL16-F
廠商: Exar Corporation
文件頁數(shù): 34/56頁
文件大?。?/td> 0K
描述: IC UART FIFO I2C/SPI 64B 16QFN
標(biāo)準(zhǔn)包裝: 490
特點(diǎn): *
通道數(shù): 1,UART
FIFO's: 64 字節(jié)
規(guī)程: RS485
電源電壓: 2.25 V ~ 3.6 V
帶自動流量控制功能:
帶IrDA 編碼器/解碼器:
帶故障啟動位檢測功能:
帶調(diào)制解調(diào)器控制功能:
帶CMOS:
安裝類型: 表面貼裝
封裝/外殼: 16-VQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 16-QFN-EP(4x4)
包裝: 散裝
其它名稱: 1016-1475
XR20M1170IL16-F-ND
XR20M1170
4
I2C/SPI UART WITH 64-BYTE FIFO
REV. 1.1.0
Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain.
RESET#
18
12
21
14
I
Reset (active LOW) - A longer than 40 ns LOW
pulse on this pin will reset the internal registers and
all outputs. The UART transmitter output will be
idle and the receiver input will be ignored.
CTS#
19
13
22
15
I
UART Clear-To-Send. This input can be used for
Auto CTS Hardware Flow Control or as a general
purpose input.
GPIO6
CD#
20
-
23
-
I/O
General purpose I/O pin or CD# input.
GPIO7
RI#
21
-
24
-
I/O
General purpose I/O pin or RI# input.
VCC
22
14
1
16
Pwr 1.62V to 3.6V power supply.
A0
CS#
23
15
2
1
I
I2C-bus device address select A0 or SPI chip
select. If I2C-bus configuration is selected, this pin
along with the A1 pin allows user to change the
device’s base address. If SPI configuration is
selected, this pin is the SPI chip select pin
(Schmitt-trigger, active LOW).
A1
SI
24
16
3
2
I
I2C-bus device address select A1 or SPI data input
pin. If I2C-bus onfiguration is selected, this pin
along with A0 pin allows user to change the
device’s base address. If SPI configuration is
selected, this pin is the SPI data input pin.
SO
1
4
3
O
SPI data output pin. If SPI configuration is
selected then this pin is a three-stateable output
pin. If I2C-bus configuration is selected, this pin is
undefined and must be left unconnected.
-
PAD
-
Pwr The center pad on the backside of the QFN pack-
ages is metallic and is not electrically connected to
anything inside the device. It must be soldered on
to the PCB and may be optionally connected to
GND on the PCB. The thermal pad size on the
PCB should be the approximate size of this center
pad and should be solder mask defined. The sol-
der mask opening should be at least 0.0025"
inwards from the edge of the PCB thermal pad.
NC
-
No Connection.
Pin Description
NAME
24-QFN
PIN #
16-QFN
PIN #
24-TSSOP
PIN#
16-TSSOP
PIN #
TYPE
DESCRIPTION
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