參數(shù)資料
型號： XPC860DPCZP50D3
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT07; No. of Contacts:19; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle
中文描述： 32-BIT, 50 MHz, RISC PROCESSOR, PBGA357
封裝： PLASTIC, BGA-357
文件頁數(shù)： 71/76頁
文件大?。?/td> 857K
代理商： XPC860DPCZP50D3
MOTOROLA
MPC860 Family Hardware Specifications
71
Mechanical Data and Ordering Information
Table 14-33 identifies the packages and operating frequencies available for the MPC860P.
Table 14-33. MPC860P Package/Frequency Availability
Ball grid array
(ZP suffix)
50
0° to 95°C
XPC860DEZP50nn
1
XPC860DTZP50nn
XPC860ENZP50nn
XPC860SRZP50nn
XPC860TZP50nn
XPC855TZP50D4
66
0° to 95°C
XPC860DEZP66nn
XPC860DTZP66nn
XPC860ENZP66nn
XPC860SRZP66nn
XPC860TZP66nn
XPC855TZP66D4
80
0° to 95°C
XPC860DEZP80nn
XPC860DTZP80nn
XPC860ENZP80nn
XPC860SRZP80nn
XPC860TZP80nn
XPC855TZP80D4
Ball grid array
(CZP suffix)
50
–40° to 95°C
XPC860DECZP50nn
XPC860DTCZP50nn
XPC860ENCZP50nn
XPC860SRCZP50nn
XPC860TCZP50nn
XPC855TCZP50D4
66
–40° to 95°C
XPC860DECZP66nn
XPC860DTCZP66nn
XPC860ENCZP66nn
XPC860SRCZP66nn
XPC860TCZP66nn
XPC855TCZP66D4
1
Where nn specifies version D.3 (as D3) or D.4 (as D4).
Package Type
Frequency
(MHz)
Temperature
(Tj)
Order Number
Ball grid array
(ZP suffix)
50
0° to 95°C
XPC860DPZP50nn
1
XPC860PZP50nn
1
Where nn specifies version D.3 (as D3) or D.4 (as D4).
66
0° to 95°C
XPC860DPZP66nn
XPC860PZP66nn
80
0° to 95°C
XPC860DPZP80nn
XPC860PZP80nn
Ball grid array
(CZP suffix)
50
–40° to 95°C
XPC860DPCZP50nn
XPC860PCZP50nn
66
–40° to 95°C
XPC860DPCZP66nn
XPC860PCZP66nn
Table 14-32. MPC860 Family Package/Frequency Availability (continued)
相關(guān)PDF資料
PDF描述
XPC860DEZP50D4 Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT07; Number of Contacts:5; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle
XPC860DTZP50D4 Circular Connector; No. of Contacts:5; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:14; Circular Contact Gender:Socket; Circular Shell Style:Jam Nut Receptacle; Insert Arrangement:14-5
XPC860ENZP50D4 Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT07; Number of Contacts:23; Connector Shell Size:16; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle
XPC860SRZP50D4 Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT07; No. of Contacts:23; Connector Shell Size:16; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle
XPC860TZP50D4 Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT07; Number of Contacts:26; Connector Shell Size:16; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XPC860DPCZP50D4 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Family Hardware Specifications
XPC860DPCZP66D3 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Family Hardware Specifications
XPC860DPCZP66D4 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Family Hardware Specifications
XPC860DPZ50D3 制造商:未知廠家 制造商全稱:未知廠家 功能描述:COMMUNICATIONS CONTROLLER
XPC860DPZ66D3 制造商:未知廠家 制造商全稱:未知廠家 功能描述:COMMUNICATIONS CONTROLLER
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