<menuitem id="hlb68"></menuitem>
<dfn id="hlb68"><dd id="hlb68"><dfn id="hlb68"></dfn></dd></dfn>
<form id="hlb68"></form>
<code id="hlb68"><label id="hlb68"></label></code>
  • <li id="hlb68"><tr id="hlb68"></tr></li>
    <code id="hlb68"><input id="hlb68"></input></code>
    • 參數(shù)資料
      型號: XPC850DEVR80BU
      廠商: Freescale Semiconductor
      文件頁數(shù): 67/72頁
      文件大?。?/td> 0K
      描述: IC MPU POWERQUICC 80MHZ 256-PBGA
      標準包裝: 60
      系列: MPC8xx
      處理器類型: 32-位 MPC8xx PowerQUICC
      速度: 80MHz
      電壓: 3.3V
      安裝類型: 表面貼裝
      封裝/外殼: 256-LBGA
      供應商設(shè)備封裝: 256-PBGA(23x23)
      包裝: 托盤
      MPC850 PowerQUICC Integrated Communications Processor Hardware Specifications, Rev. 2
      Freescale Semiconductor
      7
      Electrical and Thermal Characteristics
      — Separate power supply input to operate internal logic at 2.2 V when operating at or below
      25 MHz
      — Can be dynamically shifted between high frequency (3.3 V internal) and low frequency (2.2 V
      internal) operation
      Debug interface
      — Eight comparators: four operate on instruction address, two operate on data address, and two
      operate on data
      — The MPC850 can compare using the =,
      ≠, <, and > conditions to generate watchpoints
      — Each watchpoint can generate a breakpoint internally
      3.3-V operation with 5-V TTL compatibility on all general purpose I/O pins.
      3
      Electrical and Thermal Characteristics
      This section provides the AC and DC electrical specifications and thermal characteristics for the MPC850.
      Table 2 provides the maximum ratings.
      This device contains circuitry protecting against damage due to high-static voltage or electrical fields;
      however, it is advised that normal precautions be taken to avoid application of any voltages higher than
      maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
      inputs are tied to an appropriate logic voltage level (for example, either GND or VCC). Table 3 provides
      the package thermal characteristics for the MPC850.
      Table 2. Maximum Ratings
      (GND = 0V)
      Rating
      Symbol
      Value
      Unit
      Supply voltage
      VDDH
      -0.3 to 4.0
      V
      VDDL
      -0.3 to 4.0
      V
      KAPWR
      -0.3 to 4.0
      V
      VDDSYN
      -0.3 to 4.0
      V
      Input voltage 1
      1
      Functional operating conditions are provided with the DC electrical specifications in Table 5. Absolute maximum
      ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may
      affect device reliability or cause permanent damage to the device.
      CAUTION: All inputs that tolerate 5 V cannot be more than 2.5 V greater than the supply voltage. This restriction
      applies to power-up and normal operation (that is, if the MPC850 is unpowered, voltage greater than 2.5 V must not
      be applied to its inputs).
      Vin
      GND-0.3 to VDDH + 2.5 V
      V
      Junction temperature 2
      2
      The MPC850, a high-frequency device in a BGA package, does not provide a guaranteed maximum ambient
      temperature. Only maximum junction temperature is guaranteed. It is the responsibility of the user to consider power
      dissipation and thermal management. Junction temperature ratings are the same regardless of frequency rating of
      the device.
      Tj
      0 to 95 (standard)
      -40 to 95 (extended)
      °C
      Storage temperature range
      Tstg
      -55 to +150
      °C
      相關(guān)PDF資料
      PDF描述
      65801-007LF CONN RCPT 7POS 2.54MM VERT TIN
      XC4010XL-3TQ176C IC FPGA C-TEMP 3.3V 3SPD 176TQFP
      XPC850DEVR66BUR2 IC MPU POWERQUICC 66MHZ 256-PBGA
      1-84982-6 CONN FFC 16POS 1.00MM VERT SMD
      IDT70V08S35PF IC SRAM 512KBIT 35NS 100TQFP
      相關(guān)代理商/技術(shù)參數(shù)
      參數(shù)描述
      XPC850DEZT50B 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Communications Controller Hardware Specifications
      XPC850DEZT50BT 功能描述:IC POWER PC MPU 80MHZ 256-PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤
      XPC850DEZT50BU 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應商設(shè)備封裝:783-FCPBGA(29x29) 包裝:托盤
      XPC850DEZT50BUR2 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應商設(shè)備封裝:783-FCPBGA(29x29) 包裝:托盤
      XPC850DEZT66B 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Communications Controller Hardware Specifications