參數(shù)資料
型號(hào): XPC8260ZUIHBC
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 37/41頁(yè)
文件大?。?/td> 0K
描述: IC MPU POWERQUICC II 480-TBGA
標(biāo)準(zhǔn)包裝: 21
系列: MPC82xx
處理器類(lèi)型: 32-位 MPC82xx PowerQUICC II
速度: 200MHz
電壓: 2.5V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 480-LBGA
供應(yīng)商設(shè)備封裝: 408-TBGA(37.5x37.5)
包裝: 托盤(pán)
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
5
Electrical and Thermal Characteristics
— Up to eight TDM interfaces (4 on the MPC8255)
– Supports two groups of four TDM channels for a total of eight TDMs
– 2,048 bytes of SI RAM
– Bit or byte resolution
– Independent transmit and receive routing, frame synchronization
– Supports T1, CEPT, T1/E1, T3/E3, pulse code modulation highway, ISDN basic rate, ISDN
primary rate, Freescale interchip digital link (IDL), general circuit interface (GCI), and
user-defined TDM serial interfaces
— Eight independent baud rate generators and 20 input clock pins for supplying clocks to FCCs,
SCCs, SMCs, and serial channels
— Four independent 16-bit timers that can be interconnected as two 32-bit timers
2
Electrical and Thermal Characteristics
This section provides AC and DC electrical specifications and thermal characteristics for the MPC8260.
2.1
DC Electrical Characteristics
This section describes the DC electrical characteristics for the MPC8260. Table 1 shows the maximum
electrical ratings.
Table 1. Absolute Maximum Ratings1
1 Absolute maximum ratings are stress ratings only; functional operation (see Table 2) at the maximums is not
guaranteed. Stress beyond those listed may affect device reliability or cause permanent damage.
Rating
Symbol
Value
Unit
Core supply voltage2
2 Caution: VDD/VCCSYN must not exceed VDDH by more than 0.4 V at any time, including during power-on reset.
VDD
-0.3 – 2.75
V
PLL supply voltage2
VCCSYN
-0.3 – 2.75
V
I/O supply voltage3
3 Caution: VDDH can exceed VDD/VCCSYN by 3.3 V during power on reset by no more than 100 mSec. VDDH should
not exceed VDD/VCCSYN by more than 2.0 V during normal operation.
VDDH
-0.3 – 4.0
V
Input voltage4
4 Caution: VIN must not exceed VDDH by more than 2.5 V at any time, including during power-on reset.
VIN
GND(-0.3) – 3.6
V
Junction temperature
Tj
120
°C
Storage temperature range
TSTG
(-55) – (+150)
°C
Note:
相關(guān)PDF資料
PDF描述
IDT70P248L55BYGI IC SRAM 64KBIT 55NS 108PGA
XPC8260CZUIFBC IC MPU POWERQUICC II 480-TBGA
IDT70P247L55BYGI IC SRAM 64KBIT 55NS 100BGA
65801-135LF CLINCHER RECEPTACLE ASSY GOLD
65801-035LF CLINCHER RECEPTACLE ASS'-Y-GOLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XPC8315E-RDB 制造商:Freescale Semiconductor 功能描述:
XPC850CVR50BU 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類(lèi)型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類(lèi)型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤(pán)
XPC850CVR50BUR2 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類(lèi)型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類(lèi)型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤(pán)
XPC850CVR66BU 功能描述:IC MPU POWERQUICC 66MHZ 256-PBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類(lèi)型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類(lèi)型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤(pán)
XPC850CZT50B 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Communications Controller Hardware Specifications