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參數(shù)資料
| 型號： | XP1012-BD-000W |
| 廠商： | MIMIX BROADBAND INC |
| 元件分類： | 放大器 |
| 英文描述： | 37000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | ROHS COMPLIANT, DIE-6 |
| 文件頁數(shù)： | 4/6頁 |
| 文件大小： | 159K |
| 代理商： | XP1012-BD-000W |
Page 4 of 6
37.0-40.0 GHz GaAs MMIC
Power Amplifier
Mechanical Drawing
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.805 mg.
Bias Arrangement
Bond Pad #1 (RF In)
Bond Pad #2 (RF Out)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vg2)
Bond Pad #5 (Vd1)
Bond Pad #6 (Vg1)
Bypass Capacitors - See App Note [2]
1
3
4
5
1.260
(0.050)
0.712
(0.028)
0.0
0.712
(0.028)
2.592
(0.102)
3.590
(0.141)
6
1.917
(0.076)
0.899
(0.035)
0.299
(0.012)
2
1
3
4
5
6
2
RF Out
RF In
Vd1
Vd2
Vg1
10
Vg2
10
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
April 2007 - Rev 19-Apr-07
P1012-BD
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相關代理商/技術參數(shù) |
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|---|---|
| XP1013 | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:17.0-26.0 GHz GaAs MMIC Power Amplifier |
| XP1013-BD | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:17.0-26.0 GHz GaAs MMIC Power Amplifier |
| XP1013-BD-000V | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:17.0-26.0 GHz GaAs MMIC Power Amplifier |
| XP1013-BD-EV1 | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:17.0-26.0 GHz GaAs MMIC Power Amplifier |
| XP1013-QD-0N00 | 制造商:M/A-COM Technology Solutions 功能描述:MMW DRIVER AMPLIFIER |
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