- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄225574 > XP1003-BD-000V (MIMIX BROADBAND INC) 27000 MHz - 35000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER PDF資料下載
參數(shù)資料
| 型號(hào)： | XP1003-BD-000V |
| 廠商： | MIMIX BROADBAND INC |
| 元件分類： | 放大器 |
| 英文描述： | 27000 MHz - 35000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | ROHS COMPLIANT, DIE-13 |
| 文件頁(yè)數(shù)： | 3/6頁(yè) |
| 文件大?。?/td> | 560K |
| 代理商： | XP1003-BD-000V |
RF Out
RF In
Vd1,2
Vg1,2
VOUT1
VIN
VOUT2
Vd3,4
Vg3,4
Rin
1
2
3
4
5
6
7
8
10
9
13
12
11
1
2
3
4
5
2.500
(0.098)
1.757
(0.069)
0.677
(0.027)
0.0
0.765
(0.030)
2.157
(0.085)
3.400
(0.134)
6
7
8
1.357
(0.053)
0.957
(0.038)
1.757
(0.069)
1.357
(0.053)
0.957
(0.038)
10
9
13
12
11
2.957
(0.116)
2.557
(0.101)
2.157
(0.085)
2.757
(0.109)
27.0-35.0 GHz GaAs MMIC
Power Amplifier
Page 3 of 6
Mechanical Drawing
(Note: Engineering designator is 30H2BA0093)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Pads are 0.100 x 0.200 (0.004 x 0.008).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 5.253 mg.
Bias Arrangement
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vg2)
Bond Pad #5 (Vd2)
Bond Pad #6 (VOUT1)
Bond Pad #7 (VIN)
Bond Pad #8 (VOUT2)
Bond Pad #9 (RF Out)
Bond Pad #10 (Vd4)
Bond Pad #11 (Vg4)
Bond Pad #12 (Vd3)
Bond Pad #13 (Vg3)
Bypass Capacitors - See App Note [3]
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
April 2007 - Rev 02-Apr-07
P1003-BD
XP1003-BD
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| XP1012-BD-000W | 37000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| XR1005 | RF/MICROWAVE DOWN CONVERTER |
| XT38T32.768KHZE2 | QUARTZ CRYSTAL RESONATOR, 0.032768 MHz |
| XTL1021-1 | QUARTZ CRYSTAL RESONATOR, 16 MHz |
| XTL1022 | QUARTZ CRYSTAL RESONATOR, 24 MHz |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XP1004000-03 | 功能描述:以太網(wǎng)模塊 XPort-485 w/AES DISC-BY-MFG-05/07 RoHS:否 制造商:Lantronix 產(chǎn)品:Device Servers 數(shù)據(jù)速率:300 bps to 921.6 kbps, 10 Mbps, 100 Mbps 接口類型:Ethernet, Serial 工作電源電壓:5 V to 15 V 工作電源電流:133 mA to 400 mA 最大工作溫度:+ 70 C |
| XP1004000-03R | 功能描述:以太網(wǎng)模塊 XPort RS485 Module Encryp./Ext. Temp. RoHS:否 制造商:Lantronix 產(chǎn)品:Device Servers 數(shù)據(jù)速率:300 bps to 921.6 kbps, 10 Mbps, 100 Mbps 接口類型:Ethernet, Serial 工作電源電壓:5 V to 15 V 工作電源電流:133 mA to 400 mA 最大工作溫度:+ 70 C |
| XP100400S-03 | 功能描述:以太網(wǎng)模塊 XPORT-485 SAMPLE PACKAGE W/ CD RoHS:否 制造商:Lantronix 產(chǎn)品:Device Servers 數(shù)據(jù)速率:300 bps to 921.6 kbps, 10 Mbps, 100 Mbps 接口類型:Ethernet, Serial 工作電源電壓:5 V to 15 V 工作電源電流:133 mA to 400 mA 最大工作溫度:+ 70 C |
| XP100400S-03R | 功能描述:以太網(wǎng)模塊 XPort RS485 Sample Package RoHS:否 制造商:Lantronix 產(chǎn)品:Device Servers 數(shù)據(jù)速率:300 bps to 921.6 kbps, 10 Mbps, 100 Mbps 接口類型:Ethernet, Serial 工作電源電壓:5 V to 15 V 工作電源電流:133 mA to 400 mA 最大工作溫度:+ 70 C |
| XP1005 | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:35.0-43.0 GHz GaAs MMIC Power Amplifier |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。