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參數(shù)資料
| 型號： | XCV3200E-8BG240C |
| 廠商： | Xilinx, Inc. |
| 英文描述： | Virtex⑩-E 1.8 V Field Programmable Gate Arrays |
| 中文描述： | 的Virtex⑩娥1.8伏現(xiàn)場可編程門陣列 |
| 文件頁數(shù)： | 1/5頁 |
| 文件大小： | 87K |
| 代理商： | XCV3200E-8BG240C |
Preliminary Product Specification
www.xilinx.com
1-800-255-7778
Module 1 of 4
1
Features
Fast, High-Density 1.8 V FPGA Family
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Densities from 58 k to 4 M system gates
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130 MHz internal performance (four LUT levels)
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Designed for low-power operation
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PCI compliant 3.3 V, 32/64-bit, 33/ 66-MHz
Highly Flexible SelectI/O+ Technology
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Supports 20 high-performance interface standards
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Up to 804 singled-ended I/Os or 344 differential I/O
pairs for an aggregate bandwidth of > 100 Gb/s
Differential Signalling Support
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LVDS (622 Mb/s), BLVDS (Bus LVDS), LVPECL
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Differential I/O signals can be input, output, or I/O
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Compatible with standard differential devices
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LVPECL and LVDS clock inputs for 300+ MHz
clocks
Proprietary High-Performance SelectLink
Technology
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Double Data Rate (DDR) to Virtex-E link
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Web-based HDL generation methodology
Sophisticated SelectRAM+ Memory Hierarchy
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1 Mb of internal configurable distributed RAM
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Up to 832 Kb of synchronous internal block RAM
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True Dual-Port BlockRAM capability
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Memory bandwidth up to 1.66 Tb/s (equivalent
bandwidth of over 100 RAMBUS channels)
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Designed for high-performance Interfaces to
External Memories
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200 MHz ZBT* SRAMs
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200 Mb/s DDR SDRAMs
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Supported by free Synthesizable reference design
High-Performance Built-In Clock Management Circuitry
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Eight fully digital Delay-Locked Loops (DLLs)
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Digitally-Synthesized 50% duty cycle for Double
Data Rate (DDR) Applications
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Clock Multiply and Divide
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Zero-delay conversion of high-speed LVPECL/LVDS
clocks to any I/O standard
Flexible Architecture Balances Speed and Density
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Dedicated carry logic for high-speed arithmetic
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Dedicated multiplier support
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Cascade chain for wide-input function
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Abundant registers/latches with clock enable, and
dual synchronous/asynchronous set and reset
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Internal 3-state bussing
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IEEE 1149.1 boundary-scan logic
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Die-temperature sensor diode
Supported by Xilinx Foundation and Alliance Series
Development Systems
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Further compile time reduction of 50%
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Internet Team Design (ITD) tool ideal for
million-plus gate density designs
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Wide selection of PC and workstation platforms
SRAM-Based In-System Configuration
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Unlimited re-programmability
Advanced Packaging Options
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0.8 mm Chip-scale
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1.0 mm BGA
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1.27 mm BGA
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HQ/PQ
0.18
m
m 6-Layer Metal Process
100% Factory Tested
* ZBT is a trademark of Integrated Device Technology, Inc.
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Virtex-E 1.8 V
Field Programmable Gate Arrays
DS022-1 (v2.2) November 9, 2001
0
0
Preliminary Product Specification
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XCV3200E-8BG240I | 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex?-E 1.8 V Field Programmable Gate Arrays |
| XCV3200E-8CG1156C | 制造商:Xilinx 功能描述: |
| XCV3200E-8FG1156C | 制造商:Xilinx 功能描述: |
| XCV3200E-8FG1156I | 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex-E 1.8 V Field Programmable Gate Arrays |
| XCV3200E-8FG240C | 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex-E 1.8 V Field Programmable Gate Arrays |
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