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    參數(shù)資料
    

    


    


    
型號(hào)：
XCS30XL-4CS280C

    

    
廠(chǎng)商：
Xilinx Inc

    

    
文件頁(yè)數(shù)：
48/83頁(yè)

    

    
文件大小：
0K

    

    
描述：
IC FPGA 3.3V C-TEMP HP 280-CSBGA

    

    
標(biāo)準(zhǔn)包裝：
119

    

    
系列：
Spartan®-XL

    

    
LAB/CLB數(shù)：
576
    		

    

    
邏輯元件/單元數(shù)：
1368
    		

    

    
RAM 位總計(jì)：
18432
    		

    

    
輸入/輸出數(shù)：
192
    		

    

    
門(mén)數(shù)：
30000
    		

    

    
電源電壓：
3 V ~ 3.6 V
    		

    

    
安裝類(lèi)型：
表面貼裝
    		

    

    
工作溫度：
0°C ~ 85°C
    		

    

    
封裝/外殼：
280-TFBGA，CSPBGA
    		

    

    
供應(yīng)商設(shè)備封裝：
280-CSBGA（16x16）
    		

    

    

    

	
    
    
    

    
    
	
    Spartan and Spartan-XL FPGA Families Data Sheet
    52
    DS060 (v2.0) March 1, 2013
    Product Specification
    R
    Product Obsolete/Under Obsolescence
    Spartan-XL Family Detailed Specifications
    Definition of Terms
    In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined as
    follows:
    Advance: Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or device families.
    Values are subject to change. Use as estimates, not for production.
    Preliminary: Based on preliminary characterization. Further changes are not expected.
    Unmarked:
    Specifications not identified as either Advance or Preliminary are to be considered Final.
    Notwithstanding the definition of the above terms, all specifications are subject to change without notice.
    Except for pin-to-pin input and output parameters, the AC parameter delay specifications included in this document are
    derived from measuring internal test patterns. All specifications are representative of worst-case supply voltage and junction
    temperature conditions. The parameters included are common to popular designs and typical applications.
    Spartan-XL Family Absolute Maximum Ratings(1)
    Spartan-XL Family Recommended Operating Conditions
    Symbol
    Description
    Value
    Units
    VCC
    Supply voltage relative to GND
    –0.5 to 4.0
    V
    VIN
    Input voltage relative to GND
    5V Tolerant I/O Checked(2, 3)
    –0.5 to 5.5
    V
    Not 5V Tolerant I/Os(4, 5)
    –0.5 to VCC + 0.5
    V
    VTS
    Voltage applied to 3-state output
    5V Tolerant I/O Checked(2, 3)
    –0.5 to 5.5
    V
    Not 5V Tolerant I/Os(4, 5)
    –0.5 to VCC + 0.5
    V
    TSTG
    Storage temperature (ambient)
    –65 to +150
    °C
    TJ
    Junction temperature
    Plastic packages
    +125
    °C
    Notes:
    1.
    Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
    ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
    is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
    2.
    With 5V Tolerant I/Os selected, the Maximum DC overshoot must be limited to either +5.5V or 10 mA and undershoot (below GND)
    must be limited to either 0.5V or 10 mA, whichever is easier to achieve.
    3.
    With 5V Tolerant I/Os selected, the Maximum AC (during transitions) conditions are as follows; the device pins may undershoot to
    –2.0V or overshoot to + 7.0V, provided this overshoot or undershoot lasts no more than 11 ns with a forcing current no greater than
    100 mA.
    4.
    Without 5V Tolerant I/Os selected, the Maximum DC overshoot or undershoot must be limited to either 0.5V or 10 mA, whichever is
    easier to achieve.
    5.
    Without 5V Tolerant I/Os selected, the Maximum AC conditions are as follows; the device pins may undershoot to –2.0V or overshoot
    to VCC + 2.0V, provided this overshoot or undershoot lasts no more than 11 ns with a forcing current no greater than 100 mA.
    6.
    For soldering guidelines, see the Package Information on the Xilinx website.
    Symbol
    Description
    Min
    Max
    Units
    VCC
    Supply voltage relative to GND, TJ = 0°C to +85°C
    Commercial
    3.0
    3.6
    V
    Supply voltage relative to GND, TJ = –40°C to +100°C(1) Industrial
    3.0
    3.6
    V
    VIH
    High-level input voltage(2)
    50% of VCC
    5.5
    V
    VIL
    Low-level input voltage(2)
    0
    30% of VCC
    V
    TIN
    Input signal transition time
    -
    250
    ns
    Notes:
    1.
    At junction temperatures above those listed as Operating Conditions, all delay parameters increase by 0.35% per
    °C.
    2.
    Input and output measurement threshold is ~50% of VCC.
    
    
    
    
    
    


    


    

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