參數(shù)資料
型號: XCS30-3TQ144C
廠商: Xilinx Inc
文件頁數(shù): 11/83頁
文件大?。?/td> 0K
描述: IC FPGA 5V C-TEMP 144-TQFP
產(chǎn)品變化通告: Spartan,Virtex FPGA/SCD Discontinuation 18/Oct/2010
標(biāo)準(zhǔn)包裝: 60
系列: Spartan®
LAB/CLB數(shù): 576
邏輯元件/單元數(shù): 1368
RAM 位總計: 18432
輸入/輸出數(shù): 113
門數(shù): 30000
電源電壓: 4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 144-LQFP
供應(yīng)商設(shè)備封裝: 144-TQFP(20x20)
Spartan and Spartan-XL FPGA Families Data Sheet
DS060 (v2.0) March 1, 2013
19
Product Specification
R
Product Obsolete/Under Obsolescence
3-State Long Line Drivers
A pair of 3-state buffers is associated with each CLB in the
array. These 3-state buffers (BUFT) can be used to drive
signals onto the nearest horizontal longlines above and
multiplexed or bidirectional buses on the horizontal long-
lines, saving logic resources.
There is a weak keeper at each end of these two horizontal
longlines. This circuit prevents undefined floating levels.
However, it is overridden by any driver.
The buffer enable is an active High 3-state (i.e., an active
Low enable), as shown in Table 11.
Three-State Buffer Example
Figure 18 shows how to use the 3-state buffers to imple-
ment a multiplexer. The selection is accomplished by the
buffer 3-state signal.
Pay particular attention to the polarity of the T pin when
using these buffers in a design. Active High 3-state (T) is
identical to an active Low output enable, as shown in
Figure 17: Detail of Spartan/XL Dedicated Carry Logic
01
M
0
1
01
M
0
1
M
0
3
M
1
M
I
G1
G4
F2
F1
F3
COUT
COUT0
G2
G3
F4
CIN
DS060_17_080400
TO
FUNCTION
GENERATORS
M
Table 11: Three-State Buffer Functionality
IN
T
OUT
X1
Z
IN
0
IN
Figure 18: 3-state Buffers Implement a Multiplexer
DN
DC
DB
DA
ABC
N
Z = (DA A) + (DB B) + (DC C) + (DN N)
~100 k
Ω
"Weak Keeper"
DS060_18_080400
BUFT
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XCS30-3TQ144I 功能描述:IC FPGA 5V I-TEMP 144-TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan® 標(biāo)準(zhǔn)包裝:1 系列:Kintex-7 LAB/CLB數(shù):25475 邏輯元件/單元數(shù):326080 RAM 位總計:16404480 輸入/輸出數(shù):350 門數(shù):- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:900-FCBGA(31x31) 其它名稱:122-1789
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