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    參數(shù)資料
    型號(hào): XC5206-6PQ160I
    英文描述: Field Programmable Gate Array (FPGA)
    中文描述: 現(xiàn)場(chǎng)可編程門陣列(FPGA)
    文件頁(yè)數(shù): 10/73頁(yè)
    文件大?。?/td> 598K
    代理商: XC5206-6PQ160I
    R
    XC5200 Series Field Programmable Gate Arrays
    7-92
    November 5, 1998 (Version 5.2)
    non-zero hold, attach a NODELAY attribute or property to
    the flip-flop or input buffer.
    IOB Output Signals
    Output signals can be optionally inverted within the IOB,
    and pass directly to the pad. As with the inputs, a CLB
    flip-flop or latch can be used to store the output signal.
    An active-High 3-state signal can be used to place the out-
    put buffer in a high-impedance state, implementing 3-state
    outputs or bidirectional I/O. Under configuration control,
    the output (OUT) and output 3-state (T) signals can be
    inverted. The polarity of these signals is independently
    configured for each IOB.
    The XC5200 devices provide a guaranteed output sink cur-
    rent of 8 mA.
    Supported destinations for XC5200-Series device outputs
    are shown in
    Table 6
    .(For a detailed discussion of how to
    interface between 5 V and 3.3 V devices, see the 3V Prod-
    ucts section of The Programmable Logic Data Book)
    An output can be configured as open-drain (open-collector)
    by placing an OBUFT symbol in a schematic or HDL code,
    then tying the 3-state pin (T) to the output signal, and the
    input pin (I) to Ground. (See
    Figure 12
    .)
    Table 6: Supported Destinations for XC5200-Series
    Outputs
    Output Slew Rate
    The slew rate of each output buffer is, by default, reduced,
    to minimize power bus transients when switching non-criti-
    cal signals. For critical signals, attach a FAST attribute or
    property to the output buffer or flip-flop.
    For XC5200 devices, maximum total capacitive load for
    simultaneous fast mode switching in the same direction is
    200 pF for all package pins between each Power/Ground
    pin pair. For some XC5200 devices, additional internal
    Power/Ground pin pairs are connected to special Power
    and Ground planes within the packages, to reduce ground
    bounce.
    For slew-rate limited outputs this total is two times larger for
    each device type: 400 pF for XC5200 devices. This maxi-
    mum capacitive load should not be exceeded, as it can
    result in ground bounce of greater than 1.5 V amplitude and
    more than 5 ns duration. This level of ground bounce may
    cause undesired transient behavior on an output, or in the
    internal logic. This restriction is common to all high-speed
    digital ICs, and is not particular to Xilinx or the XC5200
    Series.
    XC5200-Series devices have a feature called “Soft
    Start-up,” designed to reduce ground bounce when all out-
    puts are turned on simultaneously at the end of configura-
    tion. When the configuration process is finished and the
    device starts up, the first activation of the outputs is auto-
    matically slew-rate limited. Immediately following the initial
    activation of the I/O, the slew rate of the individual outputs
    is determined by the individual configuration option for
    each IOB.
    Global Three-State
    A separate Global 3-State line (not shown in
    Figure 11
    )
    forces all FPGA outputs to the high-impedance state,
    unless boundary scan is enabled and is executing an
    EXTEST instruction. This global net (GTS) does not com-
    pete with other routing resources; it uses a dedicated distri-
    bution network.
    GTS can be driven from any user-programmable pin as a
    global 3-state input. To use this global net, place an input
    pad and input buffer in the schematic or HDL code, driving
    the GTS pin of the STARTUP symbol. A specific pin loca-
    tion can be assigned to this input using a LOC attribute or
    property, just as with any other user-programmable pad. An
    inverter can optionally be inserted after the input buffer to
    invert the sense of the Global 3-State signal. Using GTS is
    similar to Global Reset. See
    Figure 8 on page 90
    for
    details. Alternatively, GTS can be driven from any internal
    node.
    Other IOB Options
    There are a number of other programmable options in the
    XC5200-Series IOB.
    Pull-up and Pull-down Resistors
    Programmable IOB pull-up and pull-down resistors are
    useful for tying unused pins to Vcc or Ground to minimize
    power consumption and reduce noise sensitivity. The con-
    figurable pull-up resistor is a p-channel transistor that pulls
    Destination
    XC5200 Output Mode
    5 V,
    CMOS
    XC5200 device, V
    CC
    =3.3 V,
    CMOS-threshold inputs
    Any typical device, V
    CC
    = 3.3 V,
    CMOS-threshold inputs
    Any device, V
    CC
    = 5 V,
    TTL-threshold inputs
    Any device, V
    CC
    = 5 V,
    CMOS-threshold inputs
    some
    1
    1. Only if destination device has 5-V tolerant inputs
    X6702
    OPAD
    OBUFT
    Figure 12: Open-Drain Output
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