參數(shù)資料
        型號: XC4006E-3PG156C
        廠商: Xilinx Inc
        文件頁數(shù): 38/68頁
        文件大?。?/td> 0K
        描述: IC FPGA C-TEMP 5V 3SPD 156-CPGA
        產品變化通告: XC4000(E,L) Discontinuation 01/April/2002
        標準包裝: 14
        系列: XC4000E/X
        LAB/CLB數(shù): 256
        邏輯元件/單元數(shù): 608
        RAM 位總計: 8192
        輸入/輸出數(shù): 125
        門數(shù): 6000
        電源電壓: 4.75 V ~ 5.25 V
        安裝類型: 表面貼裝
        工作溫度: 0°C ~ 85°C
        封裝/外殼: 156-BCBGA
        供應商設備封裝: 156-CPGA(42.17x42.17)
        R
        May 14, 1999 (Version 1.6)
        6-47
        XC4000E and XC4000X Series Field Programmable Gate Arrays
        6
        is passed through and is captured by each FPGA when it
        recognizes the 0010 preamble. Following the length-count
        data, each FPGA outputs a High on DOUT until it has
        received its required number of data frames.
        After an FPGA has received its conguration data, it
        passes on any additional frame start bits and conguration
        data on DOUT. When the total number of conguration
        clocks applied after memory initialization equals the value
        of the 24-bit length count, the FPGAs begin the start-up
        sequence and become operational together. FPGA I/O are
        normally released two CCLK cycles after the last congura-
        tion bit is received. Figure 47 on page 53 shows the
        start-up timing for an XC4000 Series device.
        The daisy-chained bitstream is not simply a concatenation
        of the individual bitstreams. The PROM le formatter must
        be used to combine the bitstreams for a daisy-chained con-
        guration.
        Multi-Family Daisy Chain
        All Xilinx FPGAs of the XC2000, XC3000, and XC4000
        Series use a compatible bitstream format and can, there-
        fore, be connected in a daisy chain in an arbitrary
        sequence. There is, however, one limitation. The lead
        device must belong to the highest family in the chain. If the
        chain contains XC4000 Series devices, the master nor-
        mally cannot be an XC2000 or XC3000 device.
        The reason for this rule is shown in Figure 47 on page 53.
        Since all devices in the chain store the same length count
        value and generate or receive one common sequence of
        CCLK pulses, they all recognize length-count match on the
        same CCLK edge, as indicated on the left edge of
        Figure 47. The master device then generates additional
        CCLK pulses until it reaches its nish point F. The different
        families generate or require different numbers of additional
        CCLK pulses until they reach F. Not reaching F means that
        the device does not really nish its conguration, although
        DONE may have gone High, the outputs became active,
        and the internal reset was released. For the XC4000 Series
        device, not reaching F means that readback cannot be ini-
        tiated and most boundary scan instructions cannot be
        used.
        The user has some control over the relative timing of these
        events and can, therefore, make sure that they occur at the
        proper time and the nish point F is reached. Timing is con-
        trolled using options in the bitstream generation software.
        XC3000 Master with an XC4000 Series Slave
        Some designers want to use an inexpensive lead device in
        peripheral mode and have the more precious I/O pins of the
        XC4000 Series devices all available for user I/O. Figure 44
        provides a solution for that case.
        This solution requires one CLB, one IOB and pin, and an
        internal oscillator with a frequency of up to 5 MHz as a
        clock source. The XC3000 master device must be cong-
        ured with late Internal Reset, which is the default option.
        One CLB and one IOB in the lead XC3000-family device
        are used to generate the additional CCLK pulse required by
        the XC4000 Series devices. When the lead device removes
        the internal RESET signal, the 2-bit shift register responds
        to its clock input and generates an active Low output signal
        for the duration of the subsequent clock period. An external
        connection between this output and CCLK thus creates the
        extra CCLK pulse.
        Output
        Connected
        to CCLK
        OE/T
        0
        1
        0
        .
        0
        1
        .
        Reset
        X5223
        etc
        Active Low Output
        Active High Output
        Figure 44: CCLK Generation for XC3000 Master
        Driving an XC4000 Series Slave
        Product Obsolete or Under Obsolescence
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        相關代理商/技術參數(shù)
        參數(shù)描述
        XC4006E-3PG156I 功能描述:IC FPGA I-TEMP 5V 3SPD 156-CPGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:XC4000E/X 標準包裝:1 系列:Kintex-7 LAB/CLB數(shù):25475 邏輯元件/單元數(shù):326080 RAM 位總計:16404480 輸入/輸出數(shù):350 門數(shù):- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA,F(xiàn)CBGA 供應商設備封裝:900-FCBGA(31x31) 其它名稱:122-1789
        XC4006E-3PG156M 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field Programmable Gate Array (FPGA)
        XC4006E-3PQ160C 功能描述:IC FPGA 256 CLB'S 160-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:XC4000E/X 產品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標準包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計:3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應商設備封裝:120-CPGA(34.55x34.55)
        XC4006E-3PQ160I 功能描述:IC FPGA I-TEMP 5V 3SPD 160-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:XC4000E/X 標準包裝:1 系列:Kintex-7 LAB/CLB數(shù):25475 邏輯元件/單元數(shù):326080 RAM 位總計:16404480 輸入/輸出數(shù):350 門數(shù):- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA,F(xiàn)CBGA 供應商設備封裝:900-FCBGA(31x31) 其它名稱:122-1789
        XC4006E-3PQ208C 功能描述:IC FPGA 256 CLB'S 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:XC4000E/X 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA(27x27)