參數(shù)資料
型號: XC3S700A-4FT256I
廠商: Xilinx Inc
文件頁數(shù): 78/132頁
文件大小: 0K
描述: IC FPGA SPARTAN 3 256FTBGA
標(biāo)準(zhǔn)包裝: 90
系列: Spartan®-3A
LAB/CLB數(shù): 1472
邏輯元件/單元數(shù): 13248
RAM 位總計(jì): 368640
輸入/輸出數(shù): 161
門數(shù): 700000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 256-LBGA
供應(yīng)商設(shè)備封裝: 256-FTBGA
Introduction and Ordering Information
DS529-1 (v2.0) August 19, 2010
5
Configuration
Spartan-3A FPGAs are programmed by loading
configuration data into robust, reprogrammable, static
CMOS configuration latches (CCLs) that collectively control
all functional elements and routing resources. The FPGA’s
configuration data is stored externally in a PROM or some
other non-volatile medium, either on or off the board. After
applying power, the configuration data is written to the
FPGA using any of seven different modes:
Master Serial from a Xilinx Platform Flash PROM
Serial Peripheral Interface (SPI) from an
industry-standard SPI serial Flash
Byte Peripheral Interface (BPI) Up from an
industry-standard x8 or x8/x16 parallel NOR Flash
Slave Serial, typically downloaded from a processor
Slave Parallel, typically downloaded from a processor
Boundary Scan (JTAG), typically downloaded from a
processor or system tester
Furthermore, Spartan-3A FPGAs support MultiBoot
configuration, allowing two or more FPGA configuration
bitstreams to be stored in a single SPI serial Flash or a BPI
parallel NOR Flash. The FPGA application controls which
configuration to load next and when to load it.
Additionally, each Spartan-3A FPGA contains a unique,
factory-programmed Device DNA identifier useful for
tracking purposes, anti-cloning designs, or IP protection.
I/O Capabilities
The Spartan-3A FPGA SelectIO interface supports many
popular single-ended and differential standards. Table 2
shows the number of user I/Os as well as the number of
differential I/O pairs available for each device/package
combination. Some of the user I/Os are unidirectional
input-only pins as indicated in Table 2.
Spartan-3A FPGAs support the following single-ended
standards:
3.3V low-voltage TTL (LVTTL)
Low-voltage CMOS (LVCMOS) at 3.3V, 2.5V, 1.8V,
1.5V, or 1.2V
3.3V PCI at 33 MHz or 66 MHz
HSTL I, II, and III at 1.5V and 1.8V, commonly used in
memory applications
SSTL I and II at 1.8V, 2.5V, and 3.3V, commonly used
for memory applications
Spartan-3A FPGAs support the following differential
standards:
LVDS, mini-LVDS, RSDS, and PPDS I/O at 2.5V or
3.3V
Bus LVDS I/O at 2.5V
TMDS I/O at 3.3V
Differential HSTL and SSTL I/O
LVPECL inputs at 2.5V or 3.3V
Table 2: Available User I/Os and Differential (Diff) I/O Pairs
Package
VQ100
VQG100
TQ144
TQG144
FT256
FTG256
FG320
FGG320
FG400
FGG400
FG484
FGG484
FG676
FGG676
Body Size
(mm)
14 x 14(2)
20 x 20(2)
17 x 17
19 x 19
21 x 21
23 x 23
27 x 27
Device
User
Diff
User
Diff
User
Diff
User
Diff
User
Diff
User
Diff
User
Diff
XC3S50A
68
(13)
60
(24)
108
(7)
50
(24)
144
(32)
64
(32)
-
XC3S200A
68
(13)
60
(24)
-
195
(35)
90
(50)
248
(56)
112
(64)
-
XC3S400A
-
195
(35)
90
(50)
251
(59)
112
(64)
311
(63)
142
(78)
-
XC3S700A
-
161
(13)
74
(36)
-
311
(63)
142
(78)
372
(84)
165
(93)
-
XC3S1400A
-
161
(13)
74
(36)
-
375
(87)
165
(93)
502
(94)
227
(131)
Notes:
1.
The number shown in bold indicates the maximum number of I/O and input-only pins. The number shown in (italics) indicates the number
of input-only pins. The differential (Diff) input-only pin count includes both differential pairs on input-only pins and differential pairs on I/O pins
within I/O banks that are restricted to differential inputs.
2.
The footprints for the VQ/TQ packages are larger than the package body. See the Package Drawings for details.
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