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參數(shù)資料
| 型號： | XC3S400A-4FG320C |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 1/2頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC SPARTAN-3A FPGA 400K 320FBGA |
| 產(chǎn)品培訓(xùn)模塊： | Extended Spartan 3A FPGA Family |
| 標(biāo)準(zhǔn)包裝： | 84 |
| 系列： | Spartan®-3A |
| LAB/CLB數(shù)： | 896 |
| 邏輯元件/單元數(shù)： | 8064 |
| RAM 位總計： | 368640 |
| 輸入/輸出數(shù)： | 251 |
| 門數(shù)： | 400000 |
| 電源電壓： | 1.14 V ~ 1.26 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 85°C |
| 封裝/外殼： | 320-BGA |
| 供應(yīng)商設(shè)備封裝： | 320-FBGA（19x19） |
The Programmable Logic
Challenge of I/O Intensive
Designs
Traditional FPGAs are proportionate
between logic and I/O not being cost-
effective for I/O intensive designs
System designers need to quickly adapt
to fast-evolving I/O standards
High volume consumer applications
require low-cost and robust security
solutions
The Xilinx FPGA Solution
The Spartan-3A FPGAs were designed
for applications where I/O count and
capabilities matter more than logic density
The Spartan-3A platform delivers up to
502 I/Os with support for industry-leading
26 popular and emerging I/O standards
The industry’s first 90nm FPGA electronic
ID - Device DNA serial number provides
a cost-effective, robust mechanism to help
protect against reverse-engineering,
cloning and overbuilding
Xilinx is driving the multiple domain-optimized platforms for highly efficient and
optimal design solutions, instead of forcing inefficient, one-size-fits-all solutions on
significantly varying application requirements.
Spartan-3A Platform Key Features
Standard Low-Cost Features
The Spartan-3A FPGA platform is a full feature platform of five devices with
system gates ranging from 50K to 1.4M gates, and I/Os ranging from 108 to 502
I/Os, with density migration. The Spartan-3A FPGAs also support up to 576 Kbits of
fast-block RAM with byte-write enable, and up to 176 Kbits of distributed RAM.
Additionally, there are built-in multipliers for efficient DSP implementation and
Digital Clock Managers (DCMs) for system level clock management functions.
Advance Features
The advance features in the Spartan-3A platform include unique Device DNA
serial number, support for 26 I/O standards, enhanced Multi-Boot capability
with watchdog timer, dual power management modes, and Dynamic Input
Delay for precise data-to-clock centering. These advance features significantly
help shorten design cycles and lower system cost.
SPARTAN-3 GENERATION FPGAs
Xilinx Spartan
-3A FPGA Platform
The World’s Lowest-Cost I/O Optimized FPGAs
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| XC3S400A-4FG320I | 功能描述:IC SPARTAN-3A FPGA 400K 320FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
| XC3S400A-4FG400C | 功能描述:IC SPARTAN-3A FPGA 400K 400FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
| XC3S400A-4FG400I | 功能描述:IC SPARTAN-3A FPGA 400K 400FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
| XC3S400A-4FGG320C | 功能描述:IC SPARTAN-3A FPGA 400K 320FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計:226304 輸入/輸出數(shù):131 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應(yīng)商設(shè)備封裝:208-PQFP（28x28） |
| XC3S400A-4FGG320I | 功能描述:IC SPARTAN-3A FPGA 400K 320FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
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