參數(shù)資料
型號(hào)： XC3S1400A-4FGG676I
廠商： Xilinx Inc
文件頁(yè)數(shù)： 1/2頁(yè)
文件大?。?/td> 0K
描述： IC SPARTAN-3A FPGA 1400K 676FBGA
產(chǎn)品培訓(xùn)模塊： Extended Spartan 3A FPGA Family
標(biāo)準(zhǔn)包裝： 40
系列： Spartan®-3A
LAB/CLB數(shù)： 2816
邏輯元件/單元數(shù)： 25344
RAM 位總計(jì)： 589824
輸入/輸出數(shù)： 502
門(mén)數(shù)： 1400000
電源電壓： 1.14 V ~ 1.26 V
安裝類(lèi)型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 676-BGA
供應(yīng)商設(shè)備封裝： 676-FBGA（27x27）
The Programmable Logic
Challenge of I/O Intensive
Designs
Traditional FPGAs are proportionate
between logic and I/O not being cost-
effective for I/O intensive designs
System designers need to quickly adapt
to fast-evolving I/O standards
High volume consumer applications
require low-cost and robust security
solutions
The Xilinx FPGA Solution
The Spartan-3A FPGAs were designed
for applications where I/O count and
capabilities matter more than logic density
The Spartan-3A platform delivers up to
502 I/Os with support for industry-leading
26 popular and emerging I/O standards
The industry’s first 90nm FPGA electronic
ID - Device DNA serial number provides
a cost-effective, robust mechanism to help
protect against reverse-engineering,
cloning and overbuilding
Xilinx is driving the multiple domain-optimized platforms for highly efficient and
optimal design solutions, instead of forcing inefficient, one-size-fits-all solutions on
significantly varying application requirements.
Spartan-3A Platform Key Features
Standard Low-Cost Features
The Spartan-3A FPGA platform is a full feature platform of five devices with
system gates ranging from 50K to 1.4M gates, and I/Os ranging from 108 to 502
I/Os, with density migration. The Spartan-3A FPGAs also support up to 576 Kbits of
fast-block RAM with byte-write enable, and up to 176 Kbits of distributed RAM.
Additionally, there are built-in multipliers for efficient DSP implementation and
Digital Clock Managers (DCMs) for system level clock management functions.
Advance Features
The advance features in the Spartan-3A platform include unique Device DNA
serial number, support for 26 I/O standards, enhanced Multi-Boot capability
with watchdog timer, dual power management modes, and Dynamic Input
Delay for precise data-to-clock centering. These advance features significantly
help shorten design cycles and lower system cost.
SPARTAN-3 GENERATION FPGAs
Xilinx Spartan
-3A FPGA Platform
The World’s Lowest-Cost I/O Optimized FPGAs
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC3S1400A-4FT256C 制造商:Xilinx 功能描述:FPGA SPARTAN?-3A FAMILY 1.4M GATES 25344 CELLS 667MHZ 90NM T - Trays 制造商:Xilinx 功能描述:IC FPGA 161 I/O 256FTBGA 制造商:Xilinx 功能描述:IC FPGA SPARTAN3A 1400K 256FTBGA
XC3S1400A-4FT256I 功能描述:IC FPGA SPARTAN 3 256FTBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XC3S1400A-4FTG256C 功能描述:IC FPGA SPARTAN3A 1400K 256FTBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XC3S1400A-4FTG256I 功能描述:IC FPGA SPARTAN3A 1400K 256FTBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XC3S1400A-5FG484C 功能描述:IC SPARTAN-3A FPGA 1400K 484FBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
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