參數(shù)資料
型號(hào): XC2S50E-6TQ144C
廠商: Xilinx Inc
文件頁數(shù): 61/108頁
文件大?。?/td> 0K
描述: IC FPGA 1.8V 384 CLB'S 144-TQFP
產(chǎn)品變化通告: FPGA Family Discontinuation 18/Apr/2011
標(biāo)準(zhǔn)包裝: 60
系列: Spartan®-IIE
LAB/CLB數(shù): 384
邏輯元件/單元數(shù): 1728
RAM 位總計(jì): 32768
輸入/輸出數(shù): 102
門數(shù): 50000
電源電壓: 1.71 V ~ 1.89 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 144-LQFP
供應(yīng)商設(shè)備封裝: 144-TQFP(20x20)
其它名稱: 122-1204
56
DS077-4 (v3.0) August 9, 2013
Product Specification
Spartan-IIE FPGA Family: Pinout Tables
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
Package Thermal Characteristics
Table 14 provides the thermal characteristics for the various
Spartan-II FPGA package offerings. This information is also
available using the Thermal Query tool on xilinx.com
The junction-to-case thermal resistance (
θJC) indicates the
difference between the temperature measured on the
package body (case) and the die junction temperature per
watt of power consumption. The junction-to-board (
θJB)
value similarly reports the difference between the board and
junction temperature. The junction-to-ambient (
θJA) value
reports the temperature difference between the ambient
environment and the junction temperature. The
θJA value is
reported at different air velocities, measured in linear feet
per minute (LFM). The “Still Air (0 LFM)” column shows the
θJA value in a system without a fan. The thermal resistance
drops with increasing air flow.
Table 14: Spartan-IIE Package Thermal Characteristics
Package
Device
Junction-to-Case
(
θJC)
Junction-to-
Board (
θJB)
Junction-to-Ambient (
θJA)
at Different Air Flows
Units
Still Air
(0 LFM)
250 LFM
500 LFM
750 LFM
TQ144
TQG144
XC2S50E
5.8
N/A
32.3
25.1
21.5
20.1
°C/Watt
XC2S100E
5.3
N/A
31.4
24.4
20.8
19.6
°C/Watt
PQ208
PQG208
XC2S50E
7.1
N/A
35.1
25.9
22.9
21.2
°C/Watt
XC2S100E
6.1
N/A
34.2
25.2
22.3
20.7
°C/Watt
XC2S150E
6.0
N/A
34.1
25.2
22.2
20.6
°C/Watt
XC2S200E
4.6
N/A
32.4
23.9
21.2
19.6
°C/Watt
XC2S300E
4.0
N/A
31.6
23.3
20.6
19.1
°C/Watt
FT256
FTG256
XC2S50E
7.3
17.8
27.4
21.6
20.4
20.0
°C/Watt
XC2S100E
5.8
15.1
25.0
19.5
18.2
17.8
°C/Watt
XC2S150E
5.7
14.8
24.8
19.3
18.0
17.6
°C/Watt
XC2S200E
3.9
11.4
21.9
16.6
15.2
14.7
°C/Watt
XC2S300E
3.2
10.1
20.8
15.6
14.2
13.7
°C/Watt
XC2S400E
2.5
8.8
19.7
14.5
13.2
12.6
°C/Watt
FG456
FGG456
XC2S100E
8.4
14.9
24.3
19.2
18.1
17.4
°C/Watt
XC2S150E
8.2
14.6
24.1
19.0
17.9
17.1
°C/Watt
XC2S200E
6.3
11.6
21.0
16.1
15.0
14.3
°C/Watt
XC2S300E
5.6
10.4
19.9
15.1
13.9
13.2
°C/Watt
XC2S400E
3.6
6.5
17.7
11.7
10.5
10.0
°C/Watt
XC2S600E
2.7
5.0
17.3
11.2
10.0
9.5
°C/Watt
FG676
FGG676
XC2S400E
4.1
7.9
15.6
11.1
9.8
9.2
°C/Watt
XC2S600E
3.4
6.9
14.5
9.9
8.6
7.9
°C/Watt
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XC2S50E-6TQ144Q 制造商:Rochester Electronics LLC 功能描述: 制造商:Xilinx 功能描述:
XC2S50E-6TQG144C 功能描述:IC SPARTAN-IIE FPGA 50K 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-IIE 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XC2S50E-6TQG144I 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-IIE FPGA
XC2S50E-7FG456C 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-IIE 1.8V FPGA Family