參數(shù)資料
型號(hào)： XC2S30-5VQ100C
廠(chǎng)商： Xilinx Inc
文件頁(yè)數(shù)： 49/99頁(yè)
文件大?。?/td> 0K
描述： IC FPGA 2.5V 216 CLB'S 100-VQFP
標(biāo)準(zhǔn)包裝： 90
系列： Spartan®-II
LAB/CLB數(shù)： 216
邏輯元件/單元數(shù)： 972
RAM 位總計(jì)： 24576
輸入/輸出數(shù)： 60
門(mén)數(shù)： 30000
電源電壓： 2.375 V ~ 2.625 V
安裝類(lèi)型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 100-TQFP
供應(yīng)商設(shè)備封裝： 100-VQFP（14x14）
其它名稱(chēng)： 122-1222
XC2S30-5VQ100C-ND
Spartan-II FPGA Family: DC and Switching Characteristics
DS001-3 (v2.8) June 13, 2008
Module 3 of 4
Product Specification
53
R
Power-On Requirements
Spartan-II FPGAs require that a minimum supply current
ICCPO be provided to the VCCINT lines for a successful
power-on. If more current is available, the FPGA can
consume more than ICCPO minimum, though this cannot
adversely affect reliability.
A maximum limit for ICCPO is not specified. Therefore the
use of foldback/crowbar supplies and fuses deserves
special attention. In these cases, limit the ICCPO current to a
level below the trip point for over-current protection in order
to avoid inadvertently shutting down the supply.
DC Input and Output Levels
Values for VIL and VIH are recommended input voltages.
Values for VOL and VOH are guaranteed output voltages
over the recommended operating conditions. Only selected
standards are tested. These are chosen to ensure that all
standards meet their specifications. The selected standards
are tested at minimum VCCO with the respective IOL and IOH
currents shown. Other standards are sample tested.
Symbol
Description
Conditions
New
Requirements(1)
For Devices with
Date Code 0321
or Later
Old
Requirements(1)
For Devices with
Date Code
before 0321
Units
Junction
Temperature(2)
Device
Temperature
Grade
Min
Max
Min
Max
I CCPO(3)
Total VCCINT supply
current required
during power-on
–40°C
≤ TJ<–20°C
Industrial
1.50
-
2.00
-
A
–20°C
≤ TJ < 0°C
Industrial
1.00
-
2.00
-
A
0°C
≤ TJ ≤ 85°C
Commercial
0.25
-
0.50
-
A
85°C < TJ ≤ 100°C
Industrial
0.50
-
0.50
-
A
TCCPO(4,5) VCCINT ramp time
–40°C
≤ TJ≤ 100°C
All
-
50
-
50
ms
Notes:
1.
The date code is printed on the top of the device’s package. See the "Device Part Marking" section in Module 1.
2.
The expected TJ range for the design determines the ICCPO minimum requirement. Use the applicable ranges in the junction
temperature column to find the associated current values in the appropriate new or old requirements column according to the date
code. Then choose the highest of these current values to serve as the minimum ICCPO requirement that must be met. For example,
if the junction temperature for a given design is -25°C
≤ TJ ≤ 75°C, then the new minimum ICCPO requirement is 1.5A.
If 5°C
≤ TJ ≤ 90°C, then the new minimum ICCPO requirement is 0.5A.
3.
The ICCPO requirement applies for a brief time (commonly only a few milliseconds) when VCCINT ramps from 0 to 2.5V.
4.
The ramp time is measured from GND to VCCINT max on a fully loaded board.
5.
During power-on, the VCCINT ramp must increase steadily in voltage with no dips.
6.
For more information on designing to meet the power-on specifications, refer to the application note XAPP450 "Power-On Current
Input/Output
Standard
VIL
VIH
VOL
VOH
IOL
IOH
V, Min
V, Max
V, Min
V, Max
V, Min
mA
LVTTL(1)
–0.5
0.8
2.0
5.5
0.4
2.4
24
–24
LVCMOS2
–0.5
0.7
1.7
5.5
0.4
1.9
12
–12
PCI, 3.3V
–0.5
44% VCCINT
60% VCCINT
VCCO + 0.5
10% VCCO
90% VCCO
Note (2)
PCI, 5.0V
–0.5
0.8
2.0
5.5
0.55
2.4
Note (2)
GTL
–0.5
VREF – 0.05
VREF + 0.05
3.6
0.4
N/A
40
N/A
GTL+
–0.5
VREF – 0.1
VREF + 0.1
3.6
0.6
N/A
36
N/A
HSTL I
–0.5
VREF – 0.1
VREF + 0.1
3.6
0.4
VCCO – 0.4
8
–8
HSTL III
–0.5
VREF – 0.1
VREF + 0.1
3.6
0.4
VCCO – 0.4
24
–8
HSTL IV
–0.5
VREF – 0.1
VREF + 0.1
3.6
0.4
VCCO – 0.4
48
–8
SSTL3 I
–0.5
VREF – 0.2
VREF + 0.2
3.6
VREF – 0.6
VREF + 0.6
8
–8
SSTL3 II
–0.5
VREF – 0.2
VREF + 0.2
3.6
VREF – 0.8
VREF + 0.8
16
–16
SSTL2 I
–0.5
VREF – 0.2
VREF + 0.2
3.6
VREF – 0.6
VREF + 0.6
7.6
–7.6
SSTL2 II
–0.5
VREF – 0.2
VREF + 0.2
3.6
VREF – 0.8
VREF + 0.8
15.2
–15.2
相關(guān)PDF資料
PDF描述
93LC66AT-E/ST IC EEPROM 4KBIT 2MHZ 8TSSOP
93LC66CT-E/MS IC EEPROM 4KBIT 3MHZ 8MSOP
XC3S50A-5TQG144C IC SPARTAN-3A FPGA 50K 144-TQFP
93LC66CT-E/ST IC EEPROM 4KBIT 3MHZ 8TSSOP
93C66C-E/ST IC EEPROM 4KBIT 3MHZ 8TSSOP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC2S30-5VQ100I 功能描述:IC FPGA 2.5V I-TEMP 100-VQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XC2S30-5VQG100C 功能描述:IC FPGA 2.5V 216 CLB'S 100-VQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計(jì):221184 輸入/輸出數(shù):244 門(mén)數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類(lèi)型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA（23x23） 其它名稱(chēng):220-1241
XC2S30-5VQG100I 制造商:Xilinx 功能描述:FPGA SPARTAN-II 30K GATES 972 CELLS 263MHZ 2.5V 100VTQFP - Trays 制造商:Xilinx 功能描述:IC SYSTEM GATE
XC2S30-6CS144C 功能描述:IC FPGA 2.5V C-TEMP 144-CSBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XC2S30-6CS144I 制造商:XILINX 制造商全稱(chēng):XILINX 功能描述:Spartan-II 2.5V FPGA Family:Introduction and Ordering Information
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠(chǎng)商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*