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參數(shù)資料
| 型號： | XC2S30-5TQ144I |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 10/99頁 |
| 文件大小： | 0K |
| 描述： | IC FPGA 2.5V I-TEMP 144-TQFP |
| 標準包裝： | 60 |
| 系列： | Spartan®-II |
| LAB/CLB數(shù)： | 216 |
| 邏輯元件/單元數(shù)： | 972 |
| RAM 位總計： | 24576 |
| 輸入/輸出數(shù)： | 92 |
| 門數(shù)： | 30000 |
| 電源電壓： | 2.375 V ~ 2.625 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | -40°C ~ 100°C |
| 封裝/外殼： | 144-LQFP |
| 供應商設備封裝： | 144-TQFP（20x20） |
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Spartan-II FPGA Family: Functional Description
DS001-2 (v2.8) June 13, 2008
Module 2 of 4
Product Specification
18
R
Signals
There are two kinds of pins that are used to configure
Spartan-II devices: Dedicated pins perform only specific
configuration-related functions; the other pins can serve as
general purpose I/Os once user operation has begun.
The dedicated pins comprise the mode pins (M2, M1, M0),
the configuration clock pin (CCLK), the PROGRAM pin, the
DONE pin and the boundary-scan pins (TDI, TDO, TMS,
TCK). Depending on the selected configuration mode,
CCLK may be an output generated by the FPGA, or may be
generated externally, and provided to the FPGA as an
input.
Note that some configuration pins can act as outputs. For
correct operation, these pins require a VCCO of 3.3V to drive
an LVTTL signal or 2.5V to drive an LVCMOS signal. All the
relevant pins fall in banks 2 or 3. The CS and WRITE pins
for Slave Parallel mode are located in bank 1.
For a more detailed description than that given below, see
"Pinout Tables" in Module 4 and XAPP176, Spartan-II
FPGA Series Configuration and Readback.
The Process
The sequence of steps necessary to configure Spartan-II
devices are shown in Figure 11. The overall flow can be
divided into three different phases.
Initiating Configuration
Configuration memory clear
Loading data frames
Start-up
The memory clearing and start-up phases are the same for
all configuration modes; however, the steps for the loading
of data frames are different. Thus, the details for data frame
loading are described separately in the sections devoted to
each mode.
Initiating Configuration
There are two different ways to initiate the configuration
process: applying power to the device or asserting the
PROGRAM input.
Configuration on power-up occurs automatically unless it is
delayed by the user, as described in a separate section
below. The waveform for configuration on power-up is
shown in Figure 12, page 19. Before configuration can
begin, VCCO Bank 2 must be greater than 1.0V.
Furthermore, all VCCINT power pins must be connected to a
2.5V supply. For more information on delaying
configuration, see "Clearing Configuration Memory,"
Once in user operation, the device can be re-configured
simply by pulling the PROGRAM pin Low. The device
acknowledges the beginning of the configuration process
by driving DONE Low, then enters the memory-clearing
phase.
Figure 11: Configuration Flow Diagram
FPGA Drives
INIT Low
Abort Start-up
User Holding
INIT
Low?
User Holding
PROGRAM
Low?
FPGA
Drives INIT
and DONE Low
Load
Configuration
Data Frames
User Operation
Configuration
at Power-up
DS001_11_111501
No
CRC
Correct?
Yes
FPGA
Samples
Mode Pins
Delay
Configuration
Delay
Configuration
Clear
Configuration
Memory
User Pulls
PROGRAM
Low
Start-up Sequence
FPGA Drives DONE High,
Activates I/Os,
Releases GSR net
Yes
No
Yes
No
Yes
Configuration During
User Operation
VCCO
AND
VCCINT
High?
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| XC2S30-5TQG144C | 功能描述:IC SPARTAN-II FPGA 30K 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA（27x27） |
| XC2S30-5TQG144I | 功能描述:IC FPGA 2.5V I-TEMP 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA（27x27） |
| XC2S30-5VQ100C | 功能描述:IC FPGA 2.5V 216 CLB'S 100-VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA（27x27） |
| XC2S30-5VQ100I | 功能描述:IC FPGA 2.5V I-TEMP 100-VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA（27x27） |
| XC2S30-5VQG100C | 功能描述:IC FPGA 2.5V 216 CLB'S 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標準包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計:221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應商設備封裝:388-FPBGA（23x23） 其它名稱:220-1241 |
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