- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄4293 > XC2S30-5TQ144C (Xilinx Inc)IC FPGA 2.5V 216 CLB'S 144-TQFP PDF資料下載
參數(shù)資料
| 型號： | XC2S30-5TQ144C |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 50/99頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA 2.5V 216 CLB'S 144-TQFP |
| 標準包裝： | 60 |
| 系列： | Spartan®-II |
| LAB/CLB數(shù)： | 216 |
| 邏輯元件/單元數(shù)： | 972 |
| RAM 位總計： | 24576 |
| 輸入/輸出數(shù)： | 92 |
| 門數(shù)： | 30000 |
| 電源電壓： | 2.375 V ~ 2.625 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 85°C |
| 封裝/外殼： | 144-LQFP |
| 供應(yīng)商設(shè)備封裝： | 144-TQFP（20x20） |
| 其它名稱： | 122-1221 XC2S30-5TQ144C-ND |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁當(dāng)前第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁
Spartan-II FPGA Family: DC and Switching Characteristics
DS001-3 (v2.8) June 13, 2008
Module 3 of 4
Product Specification
54
R
Switching Characteristics
All devices are 100% functionally tested. Internal timing
parameters are derived from measuring internal test
patterns. Listed below are representative values. For more
specific, more precise, and worst-case guaranteed data,
use the values reported by the static timing analyzer (TRCE
in the Xilinx Development System) and back-annotated to
the simulation netlist. All timing parameters assume
worst-case operating conditions (supply voltage and
junction temperature). Values apply to all Spartan-II devices
unless otherwise noted.
Global Clock Input to Output Delay for LVTTL, with DLL (Pin-to-Pin)(1)
Global Clock Input to Output Delay for LVTTL, without DLL (Pin-to-Pin)(1)
CTT
–0.5
VREF – 0.2
VREF + 0.2
3.6
VREF – 0.4
VREF + 0.4
8
–8
AGP
–0.5
VREF – 0.2
VREF + 0.2
3.6
10% VCCO
90% VCCO
Note (2)
Notes:
1.
VOL and VOH for lower drive currents are sample tested.
2.
Tested according to the relevant specifications.
Input/Output
Standard
VIL
VIH
VOL
VOH
IOL
IOH
V, Min
V, Max
V, Min
V, Max
V, Min
mA
Symbol
Description
Device
Speed Grade
Units
All
-6
-5
Min
Max
TICKOFDLL
Global clock input to output delay
using output flip-flop for LVTTL,
12 mA, fast slew rate, with DLL.
All
2.9
3.3
ns
Notes:
1.
Listed above are representative values where one global clock input drives one vertical clock line in each accessible column, and
where all accessible IOB and CLB flip-flops are clocked by the global clock net.
2.
Output timing is measured at 1.4V with 35 pF external capacitive load for LVTTL. The 35 pF load does not apply to the Min values.
For other I/O standards and different loads, see the tables "Constants for Calculating TIOOP" and "Delay Measurement
3.
DLL output jitter is already included in the timing calculation.
4.
For data output with different standards, adjust delays with the values shown in "IOB Output Delay Adjustments for Different
Standards," page 59. For a global clock input with standards other than LVTTL, adjust delays with values from the "I/O Standard
Symbol
Description
Device
Speed Grade
Units
All
-6
-5
Min
Max
TICKOF
Global clock input to output delay
using output flip-flop for LVTTL,
12 mA, fast slew rate, without DLL.
XC2S15
4.5
5.4
ns
XC2S30
4.5
5.4
ns
XC2S50
4.5
5.4
ns
XC2S100
4.6
5.5
ns
XC2S150
4.6
5.5
ns
XC2S200
4.7
5.6
ns
Notes:
1.
Listed above are representative values where one global clock input drives one vertical clock line in each accessible column, and
where all accessible IOB and CLB flip-flops are clocked by the global clock net.
2.
Output timing is measured at 1.4V with 35 pF external capacitive load for LVTTL. The 35 pF load does not apply to the Min values.
For other I/O standards and different loads, see the tables "Constants for Calculating TIOOP" and "Delay Measurement
3.
For data output with different standards, adjust delays with the values shown in "IOB Output Delay Adjustments for Different
Standards," page 59. For a global clock input with standards other than LVTTL, adjust delays with values from the "I/O Standard
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| RMC60DRYN-S93 | CONN EDGECARD 120PS DIP .100 SLD |
| RSC60DRYH-S93 | CONN EDGECARD 120PS DIP .100 SLD |
| RMC60DRYH-S93 | CONN EDGECARD 120PS DIP .100 SLD |
| ASC13DTES | CONN EDGECARD 26POS .100 EYELET |
| AMC13DTES | CONN EDGECARD 26POS .100 EYELET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XC2S305TQ144I | 制造商:XILINX 功能描述:New |
| XC2S30-5TQ144I | 功能描述:IC FPGA 2.5V I-TEMP 144-TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
| XC2S30-5TQG144C | 功能描述:IC SPARTAN-II FPGA 30K 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
| XC2S30-5TQG144I | 功能描述:IC FPGA 2.5V I-TEMP 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
| XC2S30-5VQ100C | 功能描述:IC FPGA 2.5V 216 CLB'S 100-VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。