參數(shù)資料
型號(hào): XC2S100E-6PQ208C
廠商: Xilinx Inc
文件頁數(shù): 40/108頁
文件大?。?/td> 0K
描述: IC FPGA 1.8V 600 CLB'S 208-PQFP
產(chǎn)品變化通告: FPGA Family Discontinuation 18/Apr/2011
標(biāo)準(zhǔn)包裝: 24
系列: Spartan®-IIE
LAB/CLB數(shù): 600
邏輯元件/單元數(shù): 2700
RAM 位總計(jì): 40960
輸入/輸出數(shù): 146
門數(shù): 100000
電源電壓: 1.71 V ~ 1.89 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 208-BFQFP
供應(yīng)商設(shè)備封裝: 208-PQFP(28x28)
其它名稱: 122-1207
DS077-3 (v3.0) August 9, 2013
37
Product Specification
Spartan-IIE FPGA Family: DC and Switching Characteristics
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
IOB Input Switching Characteristics(1)
Input delays associated with the pad are specified for LVTTL levels. For other standards, adjust the delays with the values
Symbol
Description
Device
Speed Grade
Units
-7
-6
Min
Max
Min
Max
Propagation Delays
TIOPI
Pad to I output, no delay
All
0.4
0.8
0.4
0.8
ns
TIOPID
Pad to I output, with delay
All
0.5
1.0
0.5
1.0
ns
TIOPLI
Pad to output IQ via transparent latch,
no delay
All
0.7
1.5
0.7
1.6
ns
TIOPLID
Pad to output IQ via transparent latch,
with delay
XC2S50E
1.3
3.0
1.3
3.1
ns
XC2S100E
1.3
3.0
1.3
3.1
ns
XC2S150E
1.3
3.2
1.3
3.3
ns
XC2S200E
1.3
3.2
1.3
3.3
ns
XC2S300E
1.3
3.2
1.3
3.3
ns
XC2S400E
1.4
3.2
1.4
3.4
ns
XC2S600E
1.5
3.5
1.5
3.7
ns
Sequential Delays
TIOCKIQ
Clock CLK to output IQ
All
0.1
0.7
0.1
0.7
ns
Setup/Hold Times with Respect to Clock CLK
TIOPICK / TIOICKP
Pad, no delay
All
1.4 / 0
-
1.5 / 0
-
ns
TIOPICKD / TIOICKPD Pad, with delay
XC2S50E
2.9 / 0
-
2.9 / 0
-
ns
XC2S100E
2.9 / 0
-
2.9 / 0
-
ns
XC2S150E
3.1 / 0
-
3.1 / 0
-
ns
XC2S200E
3.1 / 0
-
3.1 / 0
-
ns
XC2S300E
3.1 / 0
-
3.1 / 0
-
ns
XC2S400E
3.2 / 0
-
3.2 / 0
-
ns
XC2S600E
3.5 / 0
-
3.5 / 0
-
ns
TIOICECK / TIOCKICE ICE input
All
0.7 / 0.01
-
0.7 / 0.01
-
ns
Set/Reset Delays
TIOSRCKI
SR input (IFF, synchronous)
All
0.9
-
1.0
-
ns
TIOSRIQ
SR input to IQ (asynchronous)
All
0.5
1.2
0.5
1.4
ns
TGSRQ
GSR to output IQ
All
3.8
8.5
3.8
9.7
ns
Notes:
1.
Input timing for LVTTL is measured at 1.4V. For other I/O standards, see the table Delay Measurement Methodology, page 41.
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