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參數(shù)資料
| 型號： | XC25BS6128CL |
| 廠商： | TOREX SEMICONDUCTOR LTD. |
| 英文描述： | Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit |
| 中文描述： | 分頻信號輸出時鐘發(fā)生器IC，帶有內(nèi)置的晶體振蕩器電路 |
| 文件頁數(shù)： | 1/4頁 |
| 文件大?。?/td> | 57K |
| 代理商： | XC25BS6128CL |
XC25BS6 Series
Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit
September 17, 2003 V1
Preliminary
CMOS
Low Operating Supply Voltage
Output Frequency
Oscillation Frequency
Built-In Divider Circuit
Low Power Consumption
2.3V (MIN.)
32.768kHz
2MHz ~ 36MHz (fundamental)
Selectable from divisions of
1024, 512, 256, 128
3-State
SOT-26
APPLICATIONS
z
Crystal Oscillation Modules
z
Clocks for Micro-computers, DSPs, etc.
z
Communication Equipment
z
Various System Clocks
z
Clock Time-Base
Output
Ultra Small Package
Chip Form
GENERAL DESCRIPTION
The XC25BS6 is a low operating voltage, low current consumption
series of CMOS ICs with built-in crystal oscillator and divider circuits
designed for clock generators. Oscillation capacitors Cg and Cd are
externally set up.
Output is selectable from any one of the following values for f0:f0/1024,
f0/512, f0/256, and f0/128.
With oscillation feedback resistors built-in, it is possible to configure a
stable fundamental oscillator using about 10pF of external oscillation
capacitor and an external crystal.
The series has a stand-by function. The oscillation completely stops in
the stand-by state and output will be one of high-impedance.
FEATURES
Oscillation Frequency
2MHz ~ 36MHz (fundamental)
- Oscillation feedback resistor built-in
- External oscillation capacitor
f0/1024, f0/ 512, f0/256, f0/128
3-State
2.3 ~ 4.0V
Divider Ratio
Output
Operating Supply
Voltage Range
Supply Current
Chip Form
Package
0.5
μ
A (MAX.) when stand-by mode
Chip size 1.3 x 0.8mm
SOT-26 mini mold
PIN CONFIGURATION
PIN ASSIGNMENT
* The stand-by control pin (pin #4) has a pull-down resistor built-in.
PAD LAYOUT FOR CHIP FORM
PAD LOCATIONS
(Unit:
μ
m)
* The stand-by control pin (pin #4) has a pull-down resistor built-in.
BLOCK DIAGRAM
CE, Q0 PIN FUNCTION
CE
'L' or Open
High Impedance
Q0
Clock Output
5
6
399.0
'H'
9
VDD
Power Supply
189.0
1172.0
1172.0
430.0
4
VSS
Q0
Ground
Clock Output
952.0
1172.0
3
(NC)
No Connection
741.0
PIN NUMBER
PIN
NAME
FUNCTIONS
1
/ XT
Crystal Oscillator
Connection (Output)
Ground
Clock Output
Stand-by Control *
VSS
Q0
CE
187.0
PAD DIMENSIONS
X
Y
672.0
672.0
672.0
128.0
610.0
328.0
672.0
CE
VDD
FUNCTIONS
Crystal Oscillator
Connection (Output)
Ground
Stand-by Control *
Crystal Oscillator
Connection (Input)
Power Supply
7
Power Supply
Crystal Oscillator
Connection (Input)
1
6
XT
VSS
2
3
4
5
VDD
2
PIN
NAME
/ XT
PIN NUMBER
8
128.0
XT
128.0
Semiconductor Ltd.
6
5
4
3
2
1
/XT
VSS
Q0
XT
VDD
CE
VDD
Q0
CE
XT
/XT
VSS
VSS
(NC)
VDD
(1300,800)
(0,0)
Chip Size
Chip Thickness
Chip Back
Pad Aperture
: 1300 x 800
μ
m
: 280
±
20
μ
m
: VDD level
: 88 x 88
μ
m
Note)
There are two VSS
pads and two VDD
pads. Please connect
both VSS pads to
GND, and connect
both VDD pads to a
power supply.
Counter
VDD
/XT
XT
VSS
Q0
CE
Data Sheet
1
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