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參數(shù)資料
| 型號： | XC1701LPDG8C |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 5/13頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC PROM SER CONFIG 1M 3.3V 8-DIP |
| 產(chǎn)品變化通告： | Product Discontinuation 28/Jul/2010 |
| 標(biāo)準(zhǔn)包裝： | 50 |
| 可編程類型： | OTP |
| 存儲容量： | 1Mb |
| 電源電壓： | 3 V ~ 3.6 V |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 8-DIP（0.300"，7.62mm） |
| 供應(yīng)商設(shè)備封裝： | 8-PDIP |
| 包裝： | 管件 |
XC1700E, XC1700EL, and XC1700L Series Configuration PROMs
DS027 (v3.5) June 25, 2008
Product Specification
13
R
Notice of Disclaimer
THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND
CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED
WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE
SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.
PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE
PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES
THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE
(“CRITICAL
APPLICATIONS”). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO
APPLICABLE LAWS AND REGULATIONS.
06/13/05
3.3
Changed pinout diagrams to include Pb-free packages on "Pinout Diagrams," page 3.
Deleted T
SOL from the under "Absolute Maximum Ratings," page 7.
Added VOG8 and PCG20 to "Ordering Information," page 11. Added XC1765ELVOG8C and
XC17256EPCG20 to "Valid Ordering Combinations," page 11. Added new packages types under
07/09/07
3.4
Added Pb-free packages to "PROM Pinouts," page 2.
Note added to Table 1, page 5.
Under "XC1701, XC1736E, XC1765E, XC17128E and XC17256E", note added to "DC
Added SOG package to "Ordering Information," page 11.
Added Pb-free order codes to "Valid Ordering Combinations," page 11.
Added package type E to "Marking Information," page 12.
06/25/08
3.5
Updated "Absolute Maximum Ratings," page 7, added junction temperature rating.
Updated document template.
Updated copyright statement.
Product Obsolete or Under Obsolescence
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XC1701LPDG8I | 功能描述:IC PROM SER CONFIG 1M 3.3V 8-DIP RoHS:是 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件 |
| XC1701LSC | 制造商:Xilinx 功能描述: |
| XC1701LSO20C | 制造商:Rochester Electronics LLC 功能描述: 制造商:Xilinx 功能描述: |
| XC1701LSO20I | 制造商:XILINX 制造商全稱:XILINX 功能描述:Configuration PROMs |
| XC1701PC20C | 功能描述:IC PROM SER C-TEMP 1K 20-PLCC RoHS:否 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件 |
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