ICCAUXQ Quies" />
參數(shù)資料
型號(hào)： XA3S1600E-4FG400I
廠商： Xilinx Inc
文件頁數(shù)： 2/37頁
文件大?。?/td> 0K
描述： IC FPGA SPARTAN-3E 400FGBGA
標(biāo)準(zhǔn)包裝： 60
系列： Spartan®-3E XA
LAB/CLB數(shù)： 3688
邏輯元件/單元數(shù)： 33192
RAM 位總計(jì)： 663552
輸入/輸出數(shù)： 304
門數(shù)： 1600000
電源電壓： 1.14 V ~ 1.26 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 400-BGA
供應(yīng)商設(shè)備封裝： 400-FBGA（21x21）
DS635 (v2.0) September 9, 2009
Product Specification
10
R
ICCAUXQ
Quiescent VCCAUX
supply current
XA3S100E
13
22
mA
XA3S250E
26
43
mA
XA3S500E
34
63
mA
XA3S1200E
59
100
mA
XA3S1600E
86
150
mA
Notes:
1.
The numbers in this table are based on the conditions set forth in Table 6.
2.
Quiescent supply current is measured with all I/O drivers in a high-impedance state and with all pull-up/pull-down resistors at the I/O pads
disabled. Typical values are characterized using typical devices at room temperature (TJ of 25°C at VCCINT = 1.2 V, VCCO = 3.3V, and
VCCAUX = 2.5V). The maximum limits are tested for each device at the respective maximum specified junction temperature and at maximum
voltage limits with VCCINT = 1.26V, VCCO = 3.465V, and VCCAUX = 2.625V. The FPGA is programmed with a “blank” configuration data file
(i.e., a design with no functional elements instantiated). For conditions other than those described above, (e.g., a design including functional
elements), measured quiescent current levels may be different than the values in the table. For more accurate estimates for a specific
design, use the Xilinx XPower tools.
3.
There are two recommended ways to estimate the total power consumption (quiescent plus dynamic) for a specific design: a) The
Spartan-3E XPower Estimator provides quick, approximate, typical estimates, and does not require a netlist of the design. b) XPower
Analyzer uses a netlist as input to provide maximum estimates as well as more accurate typical estimates.
4.
The maximum numbers in this table indicate the minimum current each power rail requires in order for the FPGA to power-on successfully.
Table 8: Quiescent Supply Current Characteristics (Continued)
Symbol
Description
Device
I-Grade Maximum
Q-Grade
Maximum
Units
相關(guān)PDF資料
PDF描述
XA3S1600E-4FGG400I IC FPGA SPARTAN-3E 1600K 400FBGA
ACB91DHRR-S621 CONN EDGECARD EXTEND 182POS .050
ABB91DHRR-S621 CONN EDGECARD EXTEND 182POS .050
ACB91DHRR-S578 CONN EDGECARD EXTEND 182POS .050
ABB91DHRR-S578 CONN EDGECARD EXTEND 182POS .050
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XA3S1600E-4FGG400I 功能描述:IC FPGA SPARTAN-3E 1600K 400FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-3E XA 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
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XA3S1600E-4FGG484I 功能描述:IC FPGA SPARTAN-3E 1600K 484FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-3E XA 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
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XA3S200-4FTG256I 功能描述:IC FPGA SPARTAN-3 200K 256-FTBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-3 XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
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