參數(shù)資料
型號: XA3S1200E-4FTG256Q
廠商: Xilinx Inc
文件頁數(shù): 23/37頁
文件大小: 0K
描述: IC FPGA SPARTAN3E 1200K 256FTBGA
標準包裝: 90
系列: Spartan®-3E XA
LAB/CLB數(shù): 8672
邏輯元件/單元數(shù): 19512
RAM 位總計: 516096
輸入/輸出數(shù): 190
門數(shù): 1200000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 125°C
封裝/外殼: 256-LBGA
供應商設備封裝: 256-FTBGA
DS635 (v2.0) September 9, 2009
Product Specification
3
R
Configuration
XA Spartan-3E FPGAs are programmed by loading config-
uration data into robust, reprogrammable, static CMOS con-
figuration latches (CCLs) that collectively control all
functional elements and routing resources. The FPGA’s
configuration data is stored externally in a PROM or some
other non-volatile medium, either on or off the board. After
applying power, the configuration data is written to the
FPGA using any of five different modes:
Serial Peripheral Interface (SPI) from an
industry-standard SPI serial Flash
Byte Peripheral Interface (BPI) Up or Down from an
industry-standard x8 or x8/x16 parallel NOR Flash
Slave Serial, typically downloaded from a processor
Slave Parallel, typically downloaded from a processor
Boundary Scan (JTAG), typically downloaded from a
processor or system tester.
I/O Capabilities
The XA Spartan-3E FPGA SelectIO interface supports
many popular single-ended and differential standards.
Table 2 shows the number of user I/Os as well as the num-
ber of differential I/O pairs available for each device/pack-
age combination.
XA Spartan-3E FPGAs support the following single-ended
standards:
3.3V low-voltage TTL (LVTTL)
Low-voltage CMOS (LVCMOS) at 3.3V, 2.5V, 1.8V,
1.5V, or 1.2V
3V PCI at 33 MHz
HSTL I and III at 1.8V, commonly used in memory
applications
SSTL I at 1.8V and 2.5V, commonly used for memory
applications
Figure 1: XA Spartan-3E Family Architecture
Notes:
1.
The XA3S1200E and XA3S1600E have two additional DCMs on both the left and right sides as
indicated by the dashed lines. The XA3S100E has only one DCM at the top and one at the bottom.
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